[av_heading tag=’h2′ padding=’5′ heading=’Signal Integrity Simulation ‘ color=” style=’blockquote classic-quote’ custom_font=” size=” subheading_active=” subheading_size=’15’ custom_class=” admin_preview_bg=” av-desktop-hide=” av-medium-hide=” av-small-hide=” av-mini-hide=” av-medium-font-size-title=” av-small-font-size-title=” av-mini-font-size-title=” av-medium-font-size=” av-small-font-size=” av-mini-font-size=”][/av_heading]

[av_textblock size=” font_color=” color=” av-medium-font-size=” av-small-font-size=” av-mini-font-size=” admin_preview_bg=”]
Successful design of next-generation electronic products requires power integrity, signal integrity and thermal integrity co-analysis. SIwave uniquely handles the complexity of interconnect design from die-to-die across ICs, packages, connectors and boards. By leveraging advanced electromagnetic, thermal and mechanical simulators dynamically linked to powerful circuit and system simulation, you can understand the performance of high-speed electronic products long before building a prototype in hardware. This approach enables electronics companies to achieve a competitive advantage with faster time to market, reduced costs and improved system performance.

What you’ll learn:

  • How to quickly get simulation results in SIwave to verify the design
  • How to couple thermal results with ANSYS Icepak

[/av_textblock]

[av_hr class=’custom’ height=’50’ shadow=’no-shadow’ position=’center’ custom_border=’av-border-thin’ custom_width=’200px’ custom_border_color=” custom_margin_top=’30px’ custom_margin_bottom=’30px’ icon_select=’yes’ custom_icon_color=’#7bb0e7′ icon=’ue929′ font=’entypo-fontello’ admin_preview_bg=”]

[av_textblock size=” font_color=” color=” av-medium-font-size=” av-small-font-size=” av-mini-font-size=” admin_preview_bg=”]

[/av_textblock]