Features
- Power integrity (EM/IR) analysis and modeling with RedHawk-SC for digital, and Totem-SC for analog designs
- Electrothermal analysis of 2.5D/3D multi-die systems
- Variability-aware path timing with Path FX
- Electrostatic discharge (ESD) and reliability analysis with PathFinder-SC
- RTL power analysis and reduction with PowerArtist
- On-silicon electromagnetic analysis and modeling with RaptorH, Pharos, Exalto, and VeloceRF
- Cloud-native elastic compute architecture for full-chip capacity

Semiconductors Capabilities
Power Integrity Signoff
Learn More >Power Integrity Signoff
Dynamic and static IR drop analysis for full-chip and IP signoff of both digital and analog designs
Timing Impact of IR Drop
Learn More >Timing Impact of IR Drop
Timing analysis of critical paths with fast, SPICE-accurate, voltage variability models
2.5D/3D-IC Electrothermal Signoff
Learn More >2.5D/3D-IC Electrothermal Signoff
Chip Package System co-design
RTL Power Analysis and Reduction
Learn More >RTL Power Analysis and Reduction
Analyze, debug and reduce power and rapidly profile vectors for power-efficient RTL
Electromagnetic Analysis for Silicon
Learn More >Electromagnetic Analysis for Silicon
High Capacity Electromagnetic Modeling Engine For High-Speed RF and Digital SOCs
Electrostatic Discharge (ESD) and Substrate Noise Analysis
Learn More >Electrostatic Discharge (ESD) and Substrate Noise Analysis
Comprehensive reliability analysis and simulation for more robust designs
Cloud-Native Elastic Compute Architecture
Learn More >Cloud-Native Elastic Compute Architecture
World’s first big data architecture for electronic system design and simulation