Ozen Engineering provides expert simulation consulting services in:

  • Finite Element Analysis (FEA)
  • Computational Fluid Dynamics (CFD)
  • Optics and Photonics
  • Electromagnetic (EM) Low/High Frequency
  • ANSYS tools

Ozen Engineering is located in the heart of Silicon Valley and serves a variety of technology companies and industries. We pride ourselves on accuracy, deep experience, responsive customer service, and dependable delivery. With decades of experience under our belt we are the engineering simulation consultants of choice.

Please contact us to request a competitive quotation for consulting services. A senior engineer will contact you to discuss your project or schedule a time to meet with your team.

Talk with a Senior Engineer to define the business and technical needs of your simulation project. We can complete your Non-Disclosure Agreement (NDA) in advance if you request.

We typically request to receive:
• A brief written Statement of Work (SOW) to define the project objective and scenarios.
• 3D CAD geometry

We can quickly provide a competitive quotation. The quotation can be prepared on a fixed-cost basis, or on a Time & Materials basis. We do not charge for computation time, only engineering time.

Are you interested in raising the level of simulation in your organization but need help in kick-starting the process? A consulting project with OEI is the best way to take your organizational simulation capabilities to the next level. Our experts will not only solve your hardest problem but transfer simulation files and offer application specific training. There is no better way to supercharge an organization’s technical capabilities.
In the very early stages of a startup but need the simulation capabilities of the most advanced tool on the market? Ozen Engineering can work out a deal with startup companies to make sure they get the most innovation possible in the crucial early stages.
Our world class technical support engineers are available to help you get up to speed in the top of the line simulation tools. Our software customers already have this benefit but due to outside demand have begun to offer it separately as a product.

We take pride in serving our Silicon Valley and International customers in the following disciplines:

Physics

  • Acoustics
  • Chemical Reactions
  • Circuit & System
  • Computational Fluid Dynamics
  • Dynamics/Rotating Machines
  • Electric
  • Electromagnetic Interference (EMI)
  • Electromagnetic low-frequency & high-frequency
  • Electromechanical
  • Explicit Dynamics
  • Fluid-Structure Interaction (FSI)
  • Hydrodynamics
  • Multibody Dynamics
  • Near and Far Field Radiation
  • Optics & Lighting
  • Power Integrity (PI)
  • Process Simulation
  • Signal Integrity (SI)
  • Structural
  • Thermal
  • Turbulence Modeling (LES, DES, SBES)

Industries

  • Aerospace
  • Automotive
  • Battery
  • Biotechnology
  • Computer Hardware
  • Construction
  • Consumer Goods
  • Electric Car
  • Electronics
  • Energy
  • Healthcare
  • High-Tech
  • Industrial Equipment
  • Internet of Things (IoT)
  • Materials & Chemical Processing
  • Medical Devices/Healthcare
  • MEMS
  • Military
  • Renewable Energy
  • Rotating Machinery
  • Semiconductor
  • Sensor Design
  • Telecommunication
  • UAVs and Drones
  • Wireless Communication

Applications

  • 5G
  • Additive Manufacturing & 3D Printing
  • Antenna Design
  • Auto Painting
  • Autonomous Vehicles
  • Ball Grid Array (BGA) Thermal Resistance, Reliability, Drop
  • Battery Thermal Runaway, Electrochemistry, Impact
  • Bearing & Air Bearing
  • Bioreactor/Mixing Simulation
  • Cardboard Packaging / Corrugate Paper
  • Chip-Package-System Analysis
  • Cloud Compute
  • Combustion
  • Digital Twin for Predictive Maintenance
  • Drop Test, Impact, Explicit Dynamics, LS-DYNA
  • Electric Machines
  • Electric motor
  • Electrification
  • Electronics Thermal Management & Heat Transfer
  • Embedded Systems
  • EMC/EMI
  • Extrusion, Thermoforming & Injection Moulding
  • Flow Uniformity
  • Fracture, Fatigue & Reliability
  • High Performance Computing
  • Icing & De-Icing
  • Industrial Internet of Things (IIoT)
  • Integrated Circuits (ICs)
  • Magnet Design, Demagnetization
  • Meshing, Structured/Polyhedral/Mosaic
  • Model Based Systems Engineering (MBSE)
  • Multi-Objective Optimization
  • Noise, Vibration, Harshness (NVH)
  • Package Thermal Resistance
  • Parametric Design Optimization
  • Patient Specific Analysis
  • Predictive Maintenance
  • Process Conditions
  • Random Vibration
  • Reactor Chemistry Modeling & Methane Cracking
  • Reduced Order Modeling (ROM)
  • RF & mmWave Filter Design
  • RF, Microwave Circuits
  • Scattering Problems
  • Semiconductor Chambers
  • Shape Memory Alloys
  • Tire Modeling
  • Wireless Charging

Testing Standards

  • 3GPP, Release 15, 5G System
  • ANSI/IEC, 60529-2004, Protection Provided by Enclosures
  • ASTM, ASTM F2514-08; 2014: Standard Guide for Finite Element Analysis (FEA) of Metallic Vascular Stents Subjected to Uniform Radial Loading
  • ASTM, ASTM-F2415, FEA of Metallic Stents
  • Automotive Electronics Council, AEC-Q100 (and Q101, Q104, Q200), Failure Mechanism Based Stress Test Qualification For Integrated Circuits, Discrete Semiconductors, Multichip Modules, Passive Components
  • DNV, DNVGL-RP-C208, Determination of structural capacity by non-linear finite element analysis methods
  • FMVSS103, Windshield Defrosting and Defogging Systems
  • IEEE, IEEE 802.11, Wi-Fi network
  • IPC, IP67, Protection of electronics enclosure against dust, water, intrusion
  • IPC, IPC/JEDEC 9702, Bending, Monotonic and Cyclic (BLRT)
  • IPC, IPC-9701, Temperature Cycling (BLRT)
  • IPC, IPC-9701, Temperature Cycling (BLRT)
  • IPC, IPC-9703, Mechanical Shock
  • IPC, IPC-9707, Spherical Bend
  • ISO, ISO 11451-2, Immunity to off-vehicle radiation sources
  • ISO, ISO 16750, Environmental conditions and electrical testing for electrical and electronic equipment
  • ISO, ISO 16750-4, Start-Up and Temperature Steps (BLRT)
  • JEDEC, JEP150, Stress-Test Driven Qualification of Assembled Solid-State Surface Mount Components
  • JEDEC, JESD22A104, Condition J, Temperature Cycling (BLRT)
  • JEDEC, JESD22A105, Power Temperature Cycling (BLRT)
  • JEDEC, JESD22A113, Assembly to the board for Board Level Reliability Testing (BLRT)
  • JEDEC, JESD22A119, Low-Temperature Storage Life (BLRT)
  • JEDEC, JESD22B103, Condition 1, Vibration, Harmonic (BLRT)
  • JEDEC, JESD22B110, Condition A, Drop Testing (BLRT)
  • JEDEC, JESD22-B111, Drop test for electronics components
  • JEDEC, JESD22B113, Cyclic Bend
  • JEDEC, JESD51-14, Measuring the junction-to-case thermal resistance. It is relatively newcomer; it concerns only packages having a single heat flow and an exposed cooling surface
  • JEDEC, JESD51-2 (and JESD51-6, JESD51-8, JESD51-14), Thermal resistance of electronics packages
  • JEDEC-020C Moisture Sensitivity
  • Military, MIL-STD 461G, Electromagnetic Interference with Lightning
  • Military, MIL-STD-769, Thermal Insulation Requirements
  • Military, MIL-STD-798, Nondestructive Testing for Piping System
  • Military, MIL-STD-883, Microelectronic device testing for military and aerospace systems
  • NEBS, GR-63-CORE, Earthquake and environmental hazards for networking equipment
  • RTCA DO-160 from the American Radio Technical Commission for Aeronautics on vibration, etc.
  • SAE, SAE J3168, Reliability Physics Analysis of Electronic Equipment, Modules and Components
  • MIL-STD-810G Method 505.5 Solar Loading
  • Shock Testing

How can we help?

We have a team of leading experts in their fields ready to help you solve any engineering simulation problems.