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Electronics Cooling: Modeling Complex Geometry

Hosted Webinar

Ansys Icepak AEDT is a powerful thermal analysis software used to simulate and optimize the thermal performance of electronic systems. This webinar will provide an overview of the best practices and tips for modeling complex geometries with Ansys Icepak AEDT.

Attendees will better understand how to use Ansys Icepak AEDT to model complex geometries. The presentation will suit engineers and analysts new to Ansys Icepak AEDT or who want to improve their skills in modeling complex geometries. Click here to register.

OzenCon 2023

The Computer History Museum 1401 N. Shoreline Blvd., Mountain View

New Possibilities Through Simulation

Be a part of the largest annual simulation conference in the Bay Area.

Join us for our Annual Simulation Conference!

This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.

 View Our AgendaRegister Now

Electromigration: Theory and Simulations

Hosted Webinar

This webinar will provide an overview of when and how electromigration failures can be predicted by simulation. We will discuss what equations are solved and how they are implemented in Ansys Mechanical. The webinar notes are intended to show Ansys users how to make use of advanced functionality in Ansys to be able to solve for failures due to electromigration. Click here to register.

The topics that will be covered in this webinar include:

  • Defining Electromigration

  • Void and Hillocks

  • Dominating Physics

    • Electro-migration (Electron Wind Force)

    • Thermo-migration (Temperature Gradient Induced Driving Force)

    • Stress-migration (Stress Gradient Induced Driving Force)

    • Atomic Concentration Gradient (ACG) Migration (ACG Induced Driving Force)