ANSYS CFD Quickstart

  • November 8, 2018
    9:00 am - 5:00 pm
  • December 7, 2018
    9:00 am - 5:00 pm

Overview ANSYS CFD (Fluent and CFX) software contains the broad physical modeling capabilities needed to model flow, turbulence, heat transfer, and reactions for industrial applications ranging from air flow over an aircraft wing to combustion in a furnace, from bubble columns to oil platforms, from blood flow to semiconductor manufacturing, and from clean room design (more…)

Introducing OzenCloud

  • January 29, 2015
    3:00 am - 4:00 am

Introducing OzenCloud When: Thursday, January 29th , 2015 (11 AM-12 Noon) Where: Ozen Engineering, 1210 E. Arques Ave., #207, Sunnyvale, CA 94085 Cost: Complimentary from Ozen Engineering, Inc. (lunch included) Description: This 1-hour workshop will allow you to learn more about OzenCloud, a new service from Ozen Engineering that will allow you to run your FEA (more…)

Lunch & Learn: ANSYS Low-Frequency Electromagnetics

  • May 14, 2015
    11:30 am - 1:00 pm

Overview: This workshop will focus on ANSYS Low-Frequency Electromagnetic Simulation capabilities to analyze the electromagnetic and electromechanical systems. The ANSYS low-frequency approach allows engineers to accurately model, simulate and validate the component-, circuit- and system-level performance required for optimal product design. ANSYS Maxwell has the capabilities required to design and analyze 2D/3D electromagnetic and electromechanical (more…)

Lunch & Learn: FEA & CFD Applications in Medical Device Product Development

  • May 28, 2015
    11:30 am - 1:00 pm

Overview: This seminar will focus on how ANSYS FEA & CFD software tools can be utilized for medical device product development. Specific examples will be shown in stent fluid-structure transient modeling, heart modeling, coupling of musculoskeletal and FEA structural simulation such that patient specific and activities of daily living can be addressed. Effect of low (more…)

Introduction to BGA-Solder Joint Reliability Simulation

  • August 26, 2015
    9:00 am - 5:00 pm
  • July 13, 2018
    9:00 am - 5:00 pm

Overview In the design of Ball Grid Array (BGA) packaging design, solder joints are a frequent critical area. Learn how to improve the robustness and reliability of these parts using the capabilities of ANSYS multiphysics simulations. The topics covered in this course are: Fracture Mechanics Fatigue Creep versus Viscoplasticity Thermal Cyclic Modeling for the Calculation (more…)