Webinar Series: Improving Electronic Reliability – Thermal Reliability

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The second 30-minute webinar in our Improving Electronic Reliability series focuses on thermal analysis.


Improving Electronics Reliability: Thermal Reliability
June 16, 11:00 AM PT

Register here


Goal:

  • Improve thermal integrity
  • Optimize cooling strategies
  • Understand thermal impact on electrical and mechanical reliability

Solution:

  • Comprehensive electro-thermal and thermo-mechanical multi-physics
  • Address thermal management at multiple scales
  • 3D high-fidelity physics-based reduced order modeling (ROM) capabilities

Benefits:

  • Enhanced cooling strategies
  • Improved product reliability and decreased product development time
  • Connections to electrical, structural, reliability and ROM solutions

There is still time to register for the first webinar in the series on June 9, 11:00 AM PT.  That webinar will provide an overview of improving electronic reliability. Register today!!

Newsletter: Come learn with us – Improving Electronic Reliability

Read about the latest news from Ozen Engineering and Ansys, Inc.

May 12, 2021

Click here to view the PDF

Tire Pressure Monitoring System (TPMS) Antenna Simulation and Calculating Link Budget

Tire Pressure Monitoring System (TPMS) is one of the important part in each and every car. It notifies the driver when the tire pressure is low to decrease chance of accident while it has some other benefits such as increasing fuel efficiency.

A whip antenna with Helix extension is used to study the TPMS. First antenna is designed, studied, and tuned using HFSS. Next a rim is created, and antenna is added to it. After studying the rim, antenna and tuning them, a box is added to the model to represent a car. Then, tuning is done one more time and the receiver antenna is added.

Coupling between different antennas are studied, results are shown as S parameter, Far Field Pattern and E field values. Results are in reasonable communication range. First two videos below explain more details.  Next, the results are exported from HFSS, used in EMIT and Link Budget is studied using BFSK. Third video below will explain more details about it.

 

 

Vector Hysteresis in Solenoid

Magnetic hysteresis occurs when an external magnetic field is applied to a ferromagnet such as iron and the atomic dipoles align themselves with it. Even when the field is removed, part of the alignment will be retained: the material has become magnetized. Once magnetized, the magnet will stay magnetized indefinitely. Maxwell by Ansys enables users to assign different materials. It also enables users to add customized B-H curve. In this video, we will be using this feature to study an armature and draw its hysteresis curve.

A geometry is imported, excitations are assigned, and we illustrate how to assign material and their B-H curve. In order to make simulation faster, a 30 degree(1/12) section of the armature is chosen. Picture below shows final B-H curve and the imported geometry.

 

Vector Hysteresis in Solenoid

 

Ansys Sherlock - Electronics Reliability Prediction Software

Trace Modeling Reinforcement with Ansys Sherlock

When a thermal or thermal-stress analysis is needed for design of electronics PCB or packaging, it is important to consider the impact of copper traces. Historically, traces have been modeled using Effective Material Properties or Mapped Material Properties (Trace Mapping). The most recent and most accurate technique is Trace Reinforcement Modeling used in both Ansys Sherlock (electronics reliability prediction software) and Ansys Mechanical (finite element analysis) software tools.

The Trace Reinforcement Modeling procedure begins by loading ECAD (e.g. ODB++) into Sherlock, then exporting to an Ansys Workbench project (transfering components, materials, etc). Traces are exported from Sherlock using the .STEP file format and imported to the same Workbench project, where assignments are added for thickness and materials.

Using this simple and straightforward technique we can perform detailed and accurate Structural/Thermal/Dynamic/ Thermal-Stress analysis of the electronics assembly. We can calculate temperature, deformation, and stress distributions for the PCB, components and traces.

Ansys Sherlock - Electronics Reliability Prediction Software Ansys Sherlock - Electronics Reliability Prediction Software
Ansys Sherlock - Electronics Reliability Prediction Software Ansys Sherlock - Electronics Reliability Prediction Software

 

To learn more on how to perform this analysis, please watch this video.