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With the wireless industry developing products for the Internet of Things (IoT), 5G and commercialized unmanned aerial vehicles (UAVs), there is growing demand for simulation tools that design and integrate devices, antennas, filters and connectors into complex structures such as airframes, appliances, biomedical implants and industrial equipment. The new HFSS 3D EM component library targets these emerging applications with advanced EM solver technologies and parametric optimization, enabling wireless devices and systems to be simulated from the actual assembly of components and systems. By providing full 3-D accuracy to assemblies of varying scale, ANSYS solutions accelerate placement studies, ensure robust design to manufacturing variances and support collaboration through component sharing.

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