Webinar Transcript: Icepak Solutions for Electronic Schooling

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Lunch Learn ANSYS Icepak Alright, welcome everyone to today's webinar. It's on ice pack solutions for electronic cooling. This will be both a broad overview and introduction to ice pack as well as introducing you to a couple of the advanced techniques that ice pack offers. My name is Kaan Divringi.

I'm a project manager here at Ozen Engineering. I've been here coming up on six years and I've done a fair amount of ice pack work. A little bit about this. We are Ozen Engineering. We are located in Silicon Valley and have over 25 years of combined experience in FEA and CFD solutions.

We help our customers using our tools and provide best-in-class expertise for solutions to their problems. We solve problems, multi-physical FEA, computational fluid dynamics solutions, and we are passionate about developing accurate simulations and realistic modeling as core competencies.

We think simulation is really important and are passionate about enabling the companies around here to do simulation at an advanced level to help them realize their needs.

We have a lot of different industries that we get into here in the Silicon Valley, such as semiconductor, solar, and now automotive is becoming bigger around here with Tesla, Apple, and Google making cars. The tools we use are mostly the tools we use to make cars.

We have a lot of different models that we use. The first one we use is ANSYS. We have also developed interfaces between software that we sell, like Any2ANSYS, which is an interface between ANSYS and any skeletal modeling tool. We also do injection molding and advanced multi-objective optimization.

The tools outside of the ANSYS portfolio we bring in and we believe these are complementary and enhance the existing products in it. Here is just a snapshot of some of our clientele. These are both our customers in either consulting or software sales or training.

We work with a lot of the companies around here to help them with their advanced simulation capabilities. Some of the industry-specific expertise we have is semiconductor, of course.

We're in Silicon Valley, so we do a lot of things in here, such as multi-physical simulation of semiconductor chambers and these BGA package reliability simulations on the structural side. Also, on the structural side, thermal stress and seismic vibration.

We do a lot of these different types of analyses here. We also get into MEMS quite a bit. MEMS is pretty big around here. Another big industry around here is the solar industry. We bring the full suite of ANSYS analysis tools to bear for solar industries.

We can do both virtual prototyping through multi-objective optimization. We can do structural analysis like this wind load. This is a fluid-structure interaction.

There's actually a wind load on a solar panel here, and we calculate the pressure and then from that, bring the pressure as a boundary condition into a structural analysis and get deformation and force results. Also, design optimization. Multi-objective optimization.

When you make simulations parametric, you can automatically vary all of the parameters within the limits that you define and evaluate it for a number of different things. You can say optimize your design. You can make sure your design is robust. You can not over-optimize.

You can do a sensitivity analysis and figure out which parameters are the most important or maybe which parameters don't really matter for various outputs, not just one output and not just a handful of parameters. Many parameters, many outputs. We offer the tools to make sense of all that.

Electronics cooling is also the topic of today. Some of the analysis types we do are a lot of them. We have a lot of the types that we do. This is important for solid joint reliability but also just thermal cooling. It's like a thermal characterization on the chip board and system levels.

So it's a multi-scale and companies may be involved at different parts of the process. They may, one company may only be dealing in the chips. The others may be dealing with a device or even a data center. So we can handle all of these different length scales.

Something we'll also be getting into is consumer products. Drop tests. We have special tools as well to simulate drop tests and we do a lot of this for our customers. Something that they're interested in. Both for consumer products as well as automotive products like shown here. Biomedical industry.

We have the coupling between musculoskeletal analysis. This is a very simple process. We have a lot of software and ANSYS, so we can get a realistic kind of muscle attachment forces on a bone so we can evaluate the stresses on say an orthopedic implant under realistic boundary conditions.

So that's something that we've done and also we've developed a specialized software tool like I mentioned before that makes this process much easier. Injection molding. So injection molding is a different type of molding. It's a different type of material.

It has a few things that can be simulated to see if it's a problem to solve. And we have a specialized tool. And we can simulate this. And it's something that is very common to use in consumer products as well as packaging.

Anything that deals with encapsulation or any of that and it interacts with the structural analysis very easily as well. And this product is Planis 10. that we sell this and do work with this as well. It's a very powerful software.

So we are Ozen Engineering and we help our customers use their ANSYS to the fullest. Please visit our website for a list of future webinars, seminars, training. We have a lot of information up there. And just to keep abreast of events like this and other events coming up.

So that's essentially it for the preamble. That was the company overview. And with that, I would like to move on. Just kind of introducing the position of Icepack and give a general introduction to it. So this is kind of a table of contents for the webinar.

After I introduce Icepack, I will give some of the advantages of Icepack over the competition and will just wrap up. And discuss two Icepack applications that are on the more advanced side. Icepack position. So here is a lot of the pressures on our customers today that we find.

We have the product development markets more competitive than ever. And we have all of these things weighing on our customers. And what this does is these constraints reduce really your margin for error.

And so this means that you have to deal with things like uncertainty and complexity in a more systematic manner or risk falling behind the competition because of these pressures.

So the companies that are able to manage and make sense of this margin of error and keep on reducing that are the ones that are going to come out ahead. And this is the ANSYS vision on how you can do that. So we look at the typical engineering process as this line here.

So we have on the X-axis we have kind of a product life cycle. And the main difference here is in the cost of making a change to the product. So in the concept design if it's just a sketch on the back of a notebook or just a picture, you can make a change to it no problem.

And as the process moves along to design detail to physical prototyping and evaluation to ramp up and full production, these changes get much more expensive to make and to become more costly. And with the traditional process, we see the number of problems on the Y-axis.

With the traditional developments, design, build, and test it and see any problems out in the field or in the prototyping phase. So the majority of the problems, you're not going to see until you physically made the thing and subjected it to whatever real-world environment it's going to be under.

And so more recently, traditional CAD analysis and simulation have pushed this kind of the peak of this curve further down. And then so we can reduce the total design change cost by finding these problems earlier.

By doing simulation earlier on in the design process and reducing the overall kind of design change cost. And then so it becomes much less costly to find the best product configuration. The ANSYS vision is pushing all of these as early on as possible.

While you're still in this design and concept stage, you can with advanced simulation tools find those problems, find these complex multi-physical interrelated problems that may not be obvious. You can get most of the way to physically building and prototyping the thing in Silico.

And when you do that, it's exceedingly simple just to change a parameter in a sketch in a CAD tool or vary a material design by just a drop-down. I mean, vary a material property by just a drop-down. And then you can get most of the way to physically building and prototyping the thing in Silico.

And this is our vision really for improving the development process. And so we accomplish this through the breadth of technologies approach. So from fluid to structural to EMAG and to systems. ANSYS has the breadth as well as the depth to fully simulate your real-world product design.

The next slide. So this is the end of the presentation. Thank you. Thank you. Thank you. Thank you. Thank you. Thank you. Thank you.

And for our area of interests for today, what we will cover in I-SPAC and so I-SPAC is just one of the technologies offered by ANSYS but I will discuss actually how it interacts with some of the other software ENSYS but for I-SPAC, just using it alone, it falls under essentially the thermal CFD side of this.

PCB thermal management, fan placement, heat sink design, some of these things are what it looks at. And then it can be easily used to do a thermal mechanical stress, vibration, and drop test and so on.

The thermal analysis needs, I probably don't have to talk too much about this if you're here, but it's a very demanding market to be in. You have the demands of miniaturization, things getting smaller and smaller, and you have IC transistor features shrinking down to 12 nanometers even.

And not only that, but you have handheld devices, not just maybe mainframes that may be as large as a room. You have handheld devices, and that's a very demanding environment for a product to be in. There's platform integration, more functionality is being packed into smaller and smaller devices.

You have these system on a chip kind of modules, and those really can do a lot of functionality in a small amount of space. And you have performance enhancements, higher speed, so designing for high-speed channels and wireless communication is also a challenge.

And in addition to these miniaturization and performance increases, you'll have to do these. And so that's a challenge. And then there's the power consumption.

And power consumption is also a big thing with going green or just going more efficient due to regulation maybe and reducing energy consumption. You have all of these kind of demands, and a lot of these demands are kind of in opposition to each other.

And so that's kind of where the need for something like ISPAC comes around. ISPAC, so just kind of in a very quick sentence summary, ISPAC is the industry-focused tool for thermal simulation in the electronics space.

So ISPAC is, it falls under the general category of a CFD code, but it is built for that specific industry and has a lot of productivity enhancements for that industry that I'll be getting into here. When you're doing this type of work, you're going to have to be very careful.

So when you're doing this type of thing, it becomes important. Conjugate heat transfer. So conjugate heat transfer is something that only some CFD tools can do. So you kind of have, if you're doing FEA, you can model the solid just fine in terms of thermal analysis.

But for the fluids, you'll need to go with a convection coefficient. And you won't be capturing some heat transfer. You'll be capturing some of the complex behavior if it's present in a fluid, in an FEA analysis.

For CFD, if you just do a CFD fluids only, you'll be simulating the fluids domain just fine. But you'll have to do something like a heat flux. You'll have to have, apply just kind of a heat flux to the boundaries where the solid is. And it will have to remove heat that way.

And you won't really be simulating the actual behavior. And where the conjugate heat transfer comes into play is where it simulates both the solid and the fluid domain simultaneously. And you get a heat transfer between the two.

And then so you don't have to have convection coefficients because you're simulating the actual fluid flow. And you don't have to calculate how much heat will be removed from the fluid domain by the solid because the simulation is simulating that. So that's something that ISEPAC offers.

And it offers it in a very user-friendly way. And so what I mean by that, it takes a lot of the manual work away from you. So if you were to compare ISEPAC to a general CFD code, you know, for things like the geometry, you would have to build whatever, you know, geometry you have.

Like say for like a package or something. You would have to build that over, you know, Boolean shapes. You know, you'd have to create a sketch plane in your CAD tool. And then extrude that or, you know, revolve that.

And then you'd have to do, you know, all the operations to kind of get the final shape in ISEPAC. And also for boundary conditions, you know, same thing really.

You'll need to specify, you know, the material properties and kind of the various boundary condition types to, you know, really build up your code. While the general CFD codes are powerful, they are, you know, really meant to simulate, you know, a wide range of problems.

But where ISEPAC comes in is, you know, it has things like, you know, physical things that you'll be using in your simulation. Like, you know, PCBs or a package or a heat sink object. It actually, or fan objects. It has, you know, these buttons in the user interface tool. And you press them.

And you just add them in there. Right. And you can add them into your simulation just like that. So that's what the vertical integration means to your productivity.

You know, instead of, you know, trying to model like a fan shape or trying to, you know, model like all the parts of a package and making, you know, those modifications, you know, for meshing and so on. ISEPAC has a lot of that intelligence built in. And for contacts and interfaces.

So contacts and interfaces are, I'll get you, are important for heat transfer. And, you know, for these in the general CFE codes, a lot of times they can be kind of some headache to create if the, if kind of the automatic detection does not work.

You know, it becomes cumbersome if you have more than a couple different bodies to do these contacts and interfaces. But in ISEPAC, you know, due to its geometry engine, it is cumbersome. It is completely automatic. So that's another really nice productivity enhancement for ISEPAC.

Do you have a question? Professor, does ISEPAC have, I don't know, a library of different fans, different type of fans so I can pick up one number of fans that I want to use? Yeah. Yeah, it has a library. So it has a library of fans.

It has a library of, you know, heat sinks, of thermal interface materials, of, you know, just general like material properties. As well. And of packages. It also has a fan object where you can enter in your fan curve.

So, you know, if you have a fan that's maybe not in the library but you have a fan curve which is, you know, something very common, you know, to receive from manufacturers. All manufacturers have that.

In ISEPAC you can just, you know, put in a fan object, put in a general fan object and put in your fan curve there and, you know, to just have it. So, yeah, definitely. So that's one thing that Icepack offers. The other challenge that Icepack is well suited to is it can do multi-scale simulations.

So this is something that I mentioned earlier on in the simulation. But there are a wide variety of length scales in the electronics industry. So the electronics industry is a very general term really. But as you can kind of see from this slide, Icepack is up to the challenge.

So everything from the micron level when you're dealing with chips or packaging chips to the PCB level. The board level where you have a PCB board and you want to place a few chips on that board to the full on system level where you have a device or a room.

Icepack can deal with all of those length scales. And it has specific features to help you go up and down this length scale. So if you want to simulate small features in Icepack, Icepack has things like zoom in which is analogous to sub modeling in FEA.

It has zoom in modeling that helps you do that. It also has non-conformal mesh interfaces. So maybe the very small and detailed mesh of one part of your analysis is not going to affect or propagate out into another part of your analysis. So that's what the non-conformal mesh interfaces are like.

They're analogous to contacts in FEA. And for moving up in length in electronics industry length scales, it has things like 2D bodies. So 2D bodies do not have any thickness. So if you have a very thin layer of something, you won't have to worry about the mesh sizing in that normal direction.

Icepack will simulate it with a 2D body. And you also have compact conduction models. And so these are smart object functionality that Icepack offers to seamlessly and easily switch between more or less detailed representations of things like packages or heat sinks or fans.

So with just a drop-down menu, it can switch between more or less detailed versions of those. So these are some of the features that Icepack has for moving between these length scales.

And before I really go much further, I just want to show off the software a little bit and give you a sense of what the user interface looks like. So this is... So over here I have ANSYS Workbench.

And if you just want to use Icepack, it's just a matter of dragging and dropping Icepack onto the ANSYS Workbench project schematic. I can also launch this on its own. It doesn't have to be run from within Workbench, but when it's within Workbench, you get a lot of advantages.

It can work with other tools very nice and seamlessly. But that's essentially how you get to Icepack. And then if I just want to get into Icepack, I can double click on it and the interface comes up. And so it all happens in this window in Icepack.

And so by default in an empty project, you only have what's called your kind of the cabinet. And this is just an empty space in Icepack. And it has an extent. But this is just kind of the window. And the extent of the sort of a fluid domain in Icepack.

So if I just wanted to say simulate, I can do this. So this is just a package object. So if I just want to simulate a package floating in space here, that's what I would be simulating here. I added a package object. And we can zoom into this package object actually. And we can... Oops. I lost it.

Oh. Okay. Yeah. It went down to the corner. Well, yeah. I guess so. I'll just use this another opportunity to show a really nice feature of Icepack. Unlike, you know, mechanical or other CFD tools, it has an undo feature. So whatever it is that I did there, I can move it back. So I can move it back.

And I can see that it's not going to show up. So I can move it back. And I can see that it's not going to show up. And I can see that it's not going to show up. And I can move it back. So there we go. So this is a package object in Icepack. And we can make modifications to it.

So I have, you know, just clicked a button from the toolbar, and I can make a modification to it by editing the properties of this package object. And what we have here is, you know, we have essentially a number of different forms. We have just basically a form.

So this is like a very kind of complex and detailed form. So, you know, I don't know if, you know, maybe people in the back or farther away can read it. But, you know, we can select the package type. And we have several different package types that it can be automatically here. We can change it.

So right now it's a compact conduction model. So that means it is, you know, it has things like the soccer balls and whatnot simplified out. Into kind of a bulk material properties, orthotropic properties. But if I wanted to, I can, you know, change this model type to detailed.

And I can press update. And now it has, you know, if you can't, you know, see it, these are solder balls. So it has these solder balls, you know, each individual solder ball there, you know, in the geometry. So you can, you know, do something like that.

And then, you know, if I wanted to just specify a number of different types of balls, I can just specify the dimensions of the package. You know, maybe these form titles don't really make sense.

You know, for each of these I can view a schematic telling me, you know, what the various dimensions will be. So in this overall dimensions tab, but I can go over to this substrate tab and, you know, change things like the material, top, bottom, you know, like trace coverage percentages.

And, you know, a number of vias, substrate thicknesses. And I can make sense of all these values, you know, with this schematic here. And same for the, you know, the solder. I can specify the number of solder balls and, you know, the material and everything. And die and mold here.

And so while I'm here, I'm just going to take this opportunity to apply a power to this. And I'm also, because we're in a demo, I'm going to switch back to the simplified model of this and update. And that is essentially a package object.

And, you know, if I wanted to, you know, this is, you know, kind of ready to go. If I wanted to, I could just simulate this. I would just turn on gravity and then I would mesh it. It can automatically be meshed, you know, very easily. And, yeah, you know, it's like it's ready to go.

I haven't turned on gravity. Not much will happen right now. But if I wanted to, I could solve it. But I can, you know, do some more things. So I can add, say, a PCB object. So this PCB object also has a lot of good functionality.

So we can import, you know, E-CAD data and it can import detailed trace material data. But we're not going to get into that here. But, you know, by the simple option, it's just going to have an orthotropic kind of conductivity based on kind of thicknesses I specify here.

And I'm just going to specify these copper layer thicknesses in terms of ounce copper. And I'm going to put in something similar to kind of a standard JEDEC board here. And I'm going to do 30% conductivity for each of these. And, yeah, I think that's it.

I'm going to keep with the simple version here. But if I go detailed, I can, you know, add, you know, as many layers as I want. You have different, you know, thicknesses and materials for each layers. And I can configure vias.

You know, if I have the vias here, this will modify kind of the – there will be a special region here in the center of the circuit. Or in the center of the PCB by default. But I can move that around and it will have, you know, different thermal conductivities based on the via information I put in.

So it's really quite powerful. But I'm just going to do the basics. And simple update. And I'm just going to place the face center of this. It's a little bit hard to – it's a little hard to place the face center of that on the center of the PCB board. Okay. Okay. Okay. And so now it is aligned.

So, yeah, really what I'm going – what I can do is just to get things moving, I can do a – I can modify the edges of this cabinet. And I'm going to set the top, you know, the max Y as an opening. And I'm going to set the minimum Y as an opening as well.

And the air coming from the bottom will be, you know, ambient temperature here. And static pressure. And coming out of the top, I'm not going to have the temperature boundary condition there. Okay. And then I can just turn on gravity. Why gravity matters?

Well, because I'm not applying a forced convection flow. So this is going to be a natural convection problem. And a natural convection, as the air heats, it becomes less dense and it rises to the top. So that kind of creates a temperature-driven flow. Oh, wow. And so it can simulate that.

And I'm just going to use the basic turbulence. I'm not going to use radiation, you know, just because, you know, I just wanted to have something I can solve real quick. I'm just going to go and solve this. And another thing that I-SPAC does is it actually uses a fluent as a solver.

So if you could see my task bar here. You know, it's using a fluent. You know, this is kind of a batch version of fluent that's running in the background. But you don't have to look at this. You can look at these residuals here. These flow kind of a solve residuals here.

And this is, you know, if you've done CFD before, you should be very familiar with these. Essentially, it has XYZ and continuity and energy residuals that it needs to bring below a certain temperature.

And so it's a very simple process that it needs to bring below a certain value in order to consider it solved. And so it goes through a number of iterations. And you may or may not be able to – it may or may not actually get to our criteria by the time this solves.

But it should get close enough so we can do some post-processing. But, yeah, this is essentially what it does. And this is in serial. So this is running in serial mode on kind of an older laptop.

And I think the – I believe the mesh size is – yeah, so it's about 30,000 elements in terms of mesh size. And it's set to run for 100 iterations by default. And there it is. It's done. So if we want to post-process, we can just add post-processing objects. So I can say – Okay.

So I want a contour plot of the package and the PCB. And I can tell it to show me the contours of those. And that's essentially it. So that's the temperature contours. I can also do a cut plane. And I can show temperature contours there as well. And I can show velocity.

That temperature distribution looks a little bit weird. I may have done just a setup error in the – well, but the velocities look fine. No? Yeah. But I can do velocities here. And I can also do particle traces. And I can make these look a little bit better if I want.

So I can do no to there and just do more. Yeah. So you can get – you can see kind of the direction of the airflow and, you know, kind of what it looks like. And, you know, a little bit of kind of low velocities circulation, recirculation there.

And – but, yeah, that's essentially – so that's a very basic, you know, kind of look into, you know, what I want to do. And then you can kind of look into, you know, what ice pack on, you know, a basic level looks like. And somebody mentioned library. It does come with a library.

So the main library – so it's actually – when you access it for the first time, it has a wide variety of materials. So, you know, these kind of are the materials that it comes with by default. It also has things like fans. It has blowers.

It has PCBs, like, you know, BGA kind of components that are simplified. It has packages. These are full blown package objects. Heat sinks. It has interface materials and – these are the interface – yeah, it's interface materials and, you know, TDC units as well for thermoelectric cooling.

It can simulate those. So it has a wide variety of things. You know, just out of the box. And so that's just, you know, sort of, you know, a quick look at ice pack, you know, the basic functionality of what it looks like so we have a sense of what we're talking about. Do you have any questions?