Crash Course: Thermal Analysis of PCBs using Ansys Tools
Introduction
This course provides a comprehensive guide to DC analysis and thermal analysis of printed circuit boards (PCBs) using Ansys tools.
Step-by-Step Process
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Upload and Import Your File:
- Begin by uploading your file and importing it into SI Wave using one of the available formats.
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DC Solver Configuration:
- Select all the power planes in your model.
- Assign a voltage source at the output of your VRM and a current source on the load for each power plane.
- Configure the simulation, validate it, and proceed to simulate.
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ISPAC Utilization:
- After obtaining a solution, proceed to ISPAC within SI Wave.
- Select the desired solution from your DC solutions and launch it.
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Thermal Analysis Preparation:
- After completing the iteration, review the DC and thermal solutions.
- Select the last solution, which has the most accurate values based on adjusted copper conductivity, to send to ISPAC.
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PCB Model Configuration:
- Within the electronic desktop, locate your PCB model surrounded by dummy air regions.
- Add an enclosure and increase the air region for more accurate thermal analysis.
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Assign Boundary Conditions:
- Select all surfaces of the air region.
- Assign a thermal boundary condition, specifying it as "wall stationary" with a default temperature in centigrade.
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Plotting Results:
- With the solution ready, plot the temperature on any surface.
- Select the solder mask on top and overlay the plot field temperature on the surface.
Conclusion
This crash course provides a structured approach to performing DC and thermal analysis of PCBs using Ansys tools, ensuring accurate and reliable results.
About Ozen Engineering, Inc.
Ozen Engineering, Inc. specializes in providing advanced simulation solutions and is a trusted partner for engineering analysis.
Title: Crash Course: Thermal Analysis of PCBs Using Ansys Tools This is a crash course on DC analysis and thermal analysis. First, start by uploading your file and importing it into SI Wave using one of these forms. Step 2: Go directly to the DC solver.
Select all the power planes that you have in your model and assign voltage sources and current sources. Current sources should be on the load, and voltage sources at the output of your VRM. Do this for all the power planes. Configure simulation, validate, and now simulate.
After getting a solution, go immediately to ISPAC. Use ISPAC within SI Wave. Select which solution you want from your DC solutions and launch. Now that we have finished the iteration, we have so many DC solutions and thermal solutions.
Select the last one, as it has the most accurate value based on adjusted conductivity of the copper. Inside the electronic desktop, you'll find your PCB model with some dummy air regions around it and used ones.
I want to add an enclosure and increase the air region around it to be able to do more accurate thermal analysis. This is the air region, and this is the enclosure inside, a metallic enclosure. We assign boundary conditions to the air region. Select surface, then select all the surfaces.
Assign them a thermal boundary condition, which is wall stationary. Say you want it to be a temperature and assign it, of course, by default, in Celsius. The temperature, finish. Now that we have a solution, we can plot. Select the solder mask on top.
Choose overlay plot field temperature, surface temperature, and plot on surface. This is the temperature on the top surface.
