Posts

Introduction to BGA-Solder Joint Reliability Simulation

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  • August 26, 2015
    8:00 am - 4:00 pm
  • July 5, 2019
    8:00 am - 4:00 pm
  • July 6, 2021
    9:00 am - 5:00 pm

Overview In the design of Ball Grid Array (BGA) packaging design, solder joints are a frequent critical area. Learn how to improve the robustness and reliability of these parts using the capabilities of ANSYS multiphysics simulations. Course Topics: Fracture Mechanics Fatigue Creep versus Viscoplasticity Thermal Cyclic Modeling for the Calculation of Accumulated Fatigue Damage (Darveaux (more…)

Introduction to ANSYS Icepak


  • September 21, 2021 - September 23, 2021
    8:00 am - 4:00 pm

  Overview ANSYS Icepak provides flow and thermal management solutions for many types of electronic design applications. The primary goal of this course is to cover the basics of working in the ANSYS Icepak user environment. Students will be introduced to the world of electronics thermal modelling through a combination of lectures, workshops and examples/demonstrations. (more…)

Heat Transfer model

ANSYS Mechanical Heat Transfer (2021)


  • November 18, 2021 - November 19, 2021
    9:00 am

Overview The course introduces the nonlinear solution procedure and covers how to setup a structural nonlinear analysis, define nonlinear solution options, and review the nonlinear results. Course Topics: Fundamental Concepts of Heat Transfer Fundamental Concepts of ANSYS Mechanical Steady State Heat Transfer (no mass transport) Nonlinear and Transient Analysis Additional Convection/Heat Flux Loading Options and (more…)

ANSYS Discovery Live


  • December 10, 2021
    9:00 am - 5:00 pm

Overview This course will start you on your journey of learning with Discovery Live. Course Topics: Getting Started Structures Fluids Thermal Geometry Target Audience: Engineers and Designers Teaching Method: Lectures and computer practical sessions to validate acquired knowledge. A training certificate is provided to all attendees who complete the course. Typical Agenda 9:00AM – Class Begins 12- 1:00PM – (more…)

Events

Introduction to BGA-Solder Joint Reliability Simulation

We're sorry, but all tickets sales have ended because the event is expired.

  • August 26, 2015
    8:00 am - 4:00 pm
  • July 3, 2020
    8:00 am - 4:00 pm
  • July 5, 2019
    8:00 am - 4:00 pm

Overview In the design of Ball Grid Array (BGA) packaging design, solder joints are a frequent critical area. Learn how to improve the robustness and reliability of these parts using the capabilities of ANSYS multiphysics simulations. The topics covered in this course are: Fracture Mechanics Fatigue Creep versus Viscoplasticity Thermal Cyclic Modeling for the Calculation (more…)

Introduction to BGA-Solder Joint Reliability Simulation

We're sorry, but all tickets sales have ended because the event is expired.

  • August 26, 2015
    8:00 am - 4:00 pm
  • July 5, 2019
    8:00 am - 4:00 pm
  • July 6, 2021
    9:00 am - 5:00 pm

Overview In the design of Ball Grid Array (BGA) packaging design, solder joints are a frequent critical area. Learn how to improve the robustness and reliability of these parts using the capabilities of ANSYS multiphysics simulations. Course Topics: Fracture Mechanics Fatigue Creep versus Viscoplasticity Thermal Cyclic Modeling for the Calculation of Accumulated Fatigue Damage (Darveaux (more…)

ANSYS Mechanical Heat Transfer

We're sorry, but all tickets sales have ended because the event is expired.

  • May 16, 2018 - May 17, 2018
    8:00 am - 4:00 pm
  • August 15, 2018 - August 16, 2018
    8:00 am - 4:00 pm
  • November 27, 2018 - November 28, 2018
    9:00 am - 5:00 pm

Overview ANSYS Mechanical Heat Transfer is a 2-day training course for engineers wishing to use ANSYS Mechanical to analyze the thermal response of structures and mechanical components to heat transfer effects. Develop the skills necessary to analyze the thermal response of structures and mechanical components to various heat loads. Learn and apply complete solution procedures (more…)

ANSYS Mechanical Heat Transfer (2019)

We're sorry, but all tickets sales have ended because the event is expired.

  • February 19, 2019 - February 20, 2019
    9:00 am - 5:00 pm
  • May 30, 2019 - May 31, 2019
    8:00 am - 4:00 pm
  • August 27, 2019 - August 28, 2019
    8:00 am - 4:00 pm
  • November 26, 2019 - November 27, 2019
    9:00 am - 5:00 pm

Overview ANSYS Mechanical Heat Transfer is a 2-day training course for engineers wishing to use ANSYS Mechanical to analyze the thermal response of structures and mechanical components to heat transfer effects. Develop the skills necessary to analyze the thermal response of structures and mechanical components to various heat loads. Learn and apply complete solution procedures (more…)

ANSYS Discovery Live

We're sorry, but all tickets sales have ended because the event is expired.

  • February 22, 2019
    9:00 am - 5:00 pm
  • April 5, 2019
    8:00 am - 4:00 pm
  • June 28, 2019
    8:00 am - 4:00 pm
  • July 25, 2019
    8:00 am - 4:00 pm
  • August 22, 2019
    8:00 am - 4:00 pm
  • December 13, 2019
    9:00 am - 5:00 pm
  • February 21, 2020
    9:00 am - 5:00 pm
  • June 26, 2020
    8:00 am - 4:00 pm
  • July 23, 2020
    8:00 am - 4:00 pm
  • August 20, 2020
    8:00 am - 4:00 pm
  • December 11, 2020
    9:00 am - 5:00 pm
  • April 3, 2020
    8:00 am - 4:00 pm

Overview This course will start you on your journey of learning with Discovery Live. Course Description: Getting Started Structures Fluids Thermal Geometry Target Audience: Engineers and Designers Teaching Method: Lectures and computer practical sessions to validate acquired knowledge. A training certificate is provided to all attendees who complete the course. Typical Agenda 9:00AM – Class Begins 12- 1:00PM – (more…)