Events

Introduction to BGA-Solder Joint Reliability Simulation

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  • August 26, 2015
    8:00 am - 4:00 pm
  • July 3, 2020
    8:00 am - 4:00 pm
  • July 5, 2019
    8:00 am - 4:00 pm

Overview In the design of Ball Grid Array (BGA) packaging design, solder joints are a frequent critical area. Learn how to improve the robustness and reliability of these parts using the capabilities of ANSYS multiphysics simulations. The topics covered in this course are: Fracture Mechanics Fatigue Creep versus Viscoplasticity Thermal Cyclic Modeling for the Calculation (more…)

ANSYS Mechanical Heat Transfer

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  • May 16, 2018 - May 17, 2018
    8:00 am - 4:00 pm
  • August 15, 2018 - August 16, 2018
    8:00 am - 4:00 pm
  • November 27, 2018 - November 28, 2018
    9:00 am - 5:00 pm

Overview ANSYS Mechanical Heat Transfer is a 2-day training course for engineers wishing to use ANSYS Mechanical to analyze the thermal response of structures and mechanical components to heat transfer effects. Develop the skills necessary to analyze the thermal response of structures and mechanical components to various heat loads. Learn and apply complete solution procedures (more…)

ANSYS Mechanical Heat Transfer (2019)

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  • February 19, 2019 - February 20, 2019
    9:00 am - 5:00 pm
  • May 30, 2019 - May 31, 2019
    8:00 am - 4:00 pm
  • August 27, 2019 - August 28, 2019
    8:00 am - 4:00 pm
  • November 26, 2019 - November 27, 2019
    9:00 am - 5:00 pm

Overview ANSYS Mechanical Heat Transfer is a 2-day training course for engineers wishing to use ANSYS Mechanical to analyze the thermal response of structures and mechanical components to heat transfer effects. Develop the skills necessary to analyze the thermal response of structures and mechanical components to various heat loads. Learn and apply complete solution procedures (more…)

ANSYS Discovery Live


  • December 11, 2020
    9:00 am - 5:00 pm

Overview This course will start you on your journey of learning with Discovery Live. Course Description: Getting Started Structures Fluids Thermal Geometry Target Audience: Engineers and Designers Teaching Method: Lectures and computer practical sessions to validate acquired knowledge. A training certificate is provided to all attendees who complete the course. Typical Agenda 9:00AM – Class Begins 12- 1:00PM – (more…)

Introduction to ANSYS Icepak

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  • March 19, 2019 - March 21, 2019
    8:00 am - 4:00 pm
  • June 25, 2019 - June 27, 2019
    8:00 am - 4:00 pm
  • September 24, 2019 - September 26, 2019
    8:00 am - 4:00 pm
  • March 17, 2020 - March 19, 2020
    8:00 am - 4:00 pm
  • June 23, 2020 - June 25, 2020
    8:00 am - 4:00 pm
  • September 22, 2020 - September 24, 2020
    8:00 am - 4:00 pm

  Overview ANSYS Icepak provides flow and thermal management solutions for many types of electronic design applications. The primary goal of this course is to cover the basics of working in the ANSYS Icepak user environment. Students will be introduced to the world of electronics thermal modelling through a combination of lectures, workshops and examples/demonstrations. (more…)