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Zuken & ANSYS — Easy Approach to PCB Design

Recently, Ozen Engineering has partnered with Zuken to offer customers a better and comprehensive solution to PCB design. By coupling Zuken CR-8000, a product-centric design platform which enables engineers/designers to have a superior and user-friendly PCB design experience in terms of minimized modeling procedures and powerful built-in PCB design library, with ANSYS Electromagnetic products – Siwave and Icepak, PCB designers are able to enjoy a revolutionized work experience at design level, and to simulate at another. ANSYS Electromagnetic products help designers verify their designs by analyze circuit EMI, power/signal integrity, temperature and heat transfer in IC packages and printed circuit boards. Really, you wouldn’t find a better match than Zuken and Ansys in the PCB field.

 

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Introduction to ANSYS SIwave


  • February 22, 2019
    9:00 am - 5:00 pm

Overview ANSYS SIwave is a specialized hybrid, full-wave finite element solver engine which enables engineers to perform signal integrity and power integrity analysis of electronic packages and PCBs. The Introduction to ANSYS SIwave course covers analyses types within SIwave including DC IR drop, PCB characteristic impedance and NEXT and FEXT scanning, TDR (time domain reflectometry), (more…)

ANSYS HFSS 3D Layout


  • July 19, 2019
    9:00 am - 5:00 pm
  • July 6, 2018
    9:00 am - 5:00 pm

Overview The ANSYS HFSS 3D Layout course for high-speed printed circuit board design focuses on layered structures using the 3D Layout design type in HFSS and AEDT (ANSYS Electronic Desktop). Designed for brand new users, this course covers layer stack-up, layout viewing, choices of solvers, ports, pad-stacks, and hierarchy. Workshops include small differential via structures, (more…)

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ANSYS HFSS 3D Layout

Overview

The ANSYS HFSS 3D Layout course for high-speed printed circuit board design focuses on layered structures using the 3D Layout design type in HFSS and AEDT (ANSYS Electronic Desktop). Designed for brand new users, this course covers layer stack-up, layout viewing, choices of solvers, ports, pad-stacks, and hierarchy. Workshops include small differential via structures, larger full-PCB structures and simulations, and sub-design cutouts from larger printed circuit boards.  Several workshops follow a realistic workflow from start to finish and several workshops include transient circuit simulation of EM (electromagnetic) models.

Course Description

As a complement to the traditional arbitrary 3D CAD-based modeling interface, the HFSS 3D Layout interface is a significant productivity enhancement for IC Package and PCB designers. HFSS 3D Layout allows engineers to easily create fully parametric models and perform design studies of printed circuit boards (PCB), electronic Packages and custom integrated circuits. During this training course both Package and PCB examples will be used to highlight the functionality and automation provided by HFSS and how to improve performance and productivity. In addition, the built-in parametric interface enables design engineers to explore design alternatives and evaluate design trade-offs prior to fabrication. Complementing the engineering efficiency, a set of advanced technologies will be presented that enable faster HFSS simulations through the application of High-performance computing (HPC).

The course also includes relevant “hands-on” workshops and exercises.

Target Audience: Engineers and Designers

Teaching Method: Lectures and computer practical sessions to validate acquired knowledge. A training certificate is provided to all attendees who complete the course.

Typical Agenda

9:00AM – Class Begins

12- 1:00PM – Lunch Served

5:00PM – Class Ends

Cost: $600/day

Introduction to ANSYS SIwave


  • February 22, 2019
    9:00 am - 5:00 pm

Overview ANSYS SIwave is a specialized hybrid, full-wave finite element solver engine which enables engineers to perform signal integrity and power integrity analysis of electronic packages and PCBs. The Introduction to ANSYS SIwave course covers analyses types within SIwave including DC IR drop, PCB characteristic impedance and NEXT and FEXT scanning, TDR (time domain reflectometry), (more…)