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Ansys Sherlock - Electronics Reliability Prediction Software

Trace Modeling Reinforcement with Ansys Sherlock

When a thermal or thermal-stress analysis is needed for design of electronics PCB or packaging, it is important to consider the impact of copper traces. Historically, traces have been modeled using Effective Material Properties or Mapped Material Properties (Trace Mapping). The most recent and most accurate technique is Trace Reinforcement Modeling used in both Ansys Sherlock (electronics reliability prediction software) and Ansys Mechanical (finite element analysis) software tools.

The Trace Reinforcement Modeling procedure begins by loading ECAD (e.g. ODB++) into Sherlock, then exporting to an Ansys Workbench project (transfering components, materials, etc). Traces are exported from Sherlock using the .STEP file format and imported to the same Workbench project, where assignments are added for thickness and materials.

Using this simple and straightforward technique we can perform detailed and accurate Structural/Thermal/Dynamic/ Thermal-Stress analysis of the electronics assembly. We can calculate temperature, deformation, and stress distributions for the PCB, components and traces.

Ansys Sherlock - Electronics Reliability Prediction Software Ansys Sherlock - Electronics Reliability Prediction Software
Ansys Sherlock - Electronics Reliability Prediction Software Ansys Sherlock - Electronics Reliability Prediction Software

 

To learn more on how to perform this analysis, please watch this video.

ANSYS HFSS 3D Layout


  • July 20, 2021
    9:00 am - 5:00 pm

Overview The ANSYS HFSS 3D Layout course for high-speed printed circuit board design focuses on layered structures using the 3D Layout design type in HFSS and AEDT (ANSYS Electronic Desktop). Designed for brand new users, this course covers layer stack-up, layout viewing, choices of solvers, ports, pad-stacks, and hierarchy. Target Audience: Engineers and Designers Teaching Method: A (more…)

Introduction to ANSYS SIwave


  • June 22, 2021
    9:00 am - 5:00 pm
  • October 29, 2021
    9:00 am - 5:00 pm

Overview ANSYS SIwave is a specialized hybrid, full-wave finite element solver engine which enables engineers to perform signal integrity and power integrity analysis of electronic packages and PCBs. Prerequisites Familiarity with high-speed digital signal electronic engineering, including transmission line characteristic impedance, differential pairs, NEXT (near end cross talk) and FEXT (far end cross talk), and (more…)

Zuken & ANSYS — Easy Approach to PCB Design

Recently, Ozen Engineering has partnered with Zuken to offer customers a better and comprehensive solution to PCB design. By coupling Zuken CR-8000, a product-centric design platform which enables engineers/designers to have a superior and user-friendly PCB design experience in terms of minimized modeling procedures and powerful built-in PCB design library, with ANSYS Electromagnetic products – Siwave and Icepak, PCB designers are able to enjoy a revolutionized work experience at design level, and to simulate at another. ANSYS Electromagnetic products help designers verify their designs by analyze circuit EMI, power/signal integrity, temperature and heat transfer in IC packages and printed circuit boards. Really, you wouldn’t find a better match than Zuken and Ansys in the PCB field.

 

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Introduction to ANSYS SIwave

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  • February 20, 2020
    9:00 am - 5:00 pm
  • February 22, 2019
    9:00 am - 5:00 pm

Overview ANSYS SIwave is a specialized hybrid, full-wave finite element solver engine which enables engineers to perform signal integrity and power integrity analysis of electronic packages and PCBs. The Introduction to ANSYS SIwave course covers analyses types within SIwave including DC IR drop, PCB characteristic impedance and NEXT and FEXT scanning, TDR (time domain reflectometry), (more…)

Events

ANSYS HFSS 3D Layout

We're sorry, but all tickets sales have ended because the event is expired.

  • July 19, 2019
    8:00 am - 4:00 pm
  • July 17, 2018
    8:00 am - 4:00 pm
  • July 17, 2020
    8:00 am - 4:00 pm

Overview The ANSYS HFSS 3D Layout course for high-speed printed circuit board design focuses on layered structures using the 3D Layout design type in HFSS and AEDT (ANSYS Electronic Desktop). Designed for brand new users, this course covers layer stack-up, layout viewing, choices of solvers, ports, pad-stacks, and hierarchy. Workshops include small differential via structures, (more…)

Introduction to ANSYS SIwave

We're sorry, but all tickets sales have ended because the event is expired.

  • February 20, 2020
    9:00 am - 5:00 pm
  • February 22, 2019
    9:00 am - 5:00 pm

Overview ANSYS SIwave is a specialized hybrid, full-wave finite element solver engine which enables engineers to perform signal integrity and power integrity analysis of electronic packages and PCBs. The Introduction to ANSYS SIwave course covers analyses types within SIwave including DC IR drop, PCB characteristic impedance and NEXT and FEXT scanning, TDR (time domain reflectometry), (more…)

Introduction to ANSYS SIwave


  • June 22, 2021
    9:00 am - 5:00 pm
  • October 29, 2021
    9:00 am - 5:00 pm

Overview ANSYS SIwave is a specialized hybrid, full-wave finite element solver engine which enables engineers to perform signal integrity and power integrity analysis of electronic packages and PCBs. Prerequisites Familiarity with high-speed digital signal electronic engineering, including transmission line characteristic impedance, differential pairs, NEXT (near end cross talk) and FEXT (far end cross talk), and (more…)

ANSYS HFSS 3D Layout


  • July 20, 2021
    9:00 am - 5:00 pm

Overview The ANSYS HFSS 3D Layout course for high-speed printed circuit board design focuses on layered structures using the 3D Layout design type in HFSS and AEDT (ANSYS Electronic Desktop). Designed for brand new users, this course covers layer stack-up, layout viewing, choices of solvers, ports, pad-stacks, and hierarchy. Target Audience: Engineers and Designers Teaching Method: A (more…)