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ElectroMechanical Transducer Permittivity in ANSYS Mechanical

EM Transducer is a boundary condition commonly used in the simulations of MEMS devices.  Workbench users can download the Piezo & MEMS ACT module from the ANSYS Customer portal to gain access to EM transduce capabilities.  EM Transducer automatically generates TRANS126 elements in Workbench based on the EMTGEN APDL command.

The EM Transducer object uses permittivity of Air as a default and does not allow users to define their own permittivity.  If a user wants to define a custom permittivity, they can create an APDL command object that updates the 7th real constant of the generated TRANS126 elements.  See the sample code below:

 

 

!!! EXAMPLE APDL CODE  !!!
epsr=ARG1                                          ! USED TO DEFINE THE RELATIVE PERMITTIVITY
                                                               ! IN THE DETAILS OF THE COMMAND FILE
fini                                                         ! LEAVE THE SOLUTION PROCESSOR
/prep7
esel,s,ename,,126
*get,nelems,elem,,count                   ! nelems = NUMBER OF THESE ELEMENTS
elm=0                                                   ! INITIALIZE ELEMENT NUMBER
*do,i,1,nelems elm=elnext(elm)      ! elm = NEXT HIGHEST ELEMENT NUMBER
*get,rnum,elem,elm,attr,real           ! rnum = REAL CONSTANT ID # ASSIGNED TO ELEMENT elm
*get,r7,rcon,rnum,const,7                 ! r7 = VALUE OF 7th REAL CONSTANT IN REAL CONSTANT SET #rnum
r7_new=epsr*r7                                  ! MODIFIED VALUE TO SUBSTITUTE FOR ORIGINAL VALUE
rmod,rnum,7,r7_new                         ! MODIFY THE 7th REAL OF REAL CONSTANT SET ID #rnum
*enddo

 

fini                                                          ! LEAVE PREP7
/solu                                                       ! REENTER THE SOLUTION PROCESSOR
alls

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MEMS Multiphysics Simulations


  • May 14, 2020 - May 15, 2020
    9:00 am - 5:00 pm

Overview MEMS Multiphysics Simulation:  The course focuses on coupled physics simulation methods and techniques for common MEMS devices, such as: thermal-electric actuators, comb drive resonators, micromirrors, switches, and piezoelectric actuators. The course also includes relevant “hands-on” workshops and exercises.   Full MEMS Agenda Chapter 1 – Introduction to Multiphysics Simulation for MEMS Chapter 2 – (more…)

Events

MEMS Multiphysics Simulations

Overview

MEMS Multiphysics Simulation:  The course focuses on coupled physics simulation methods and techniques for common MEMS devices, such as: thermal-electric actuators, comb drive resonators, micromirrors, switches, and piezoelectric actuators.

The course also includes relevant “hands-on” workshops and exercises.

 

Full MEMS Agenda

Chapter 1 – Introduction to Multiphysics Simulation for MEMS

Chapter 2 – ANSYS Multiphysics

Chapter 3 – Multiphysics Simulation

Chapter 4 – Sequential Coupled-Field Simulations

Chapter 5 – Direct Coupled-Field Simulations

Chapter 6 – Coupled-Field Elements

Chapter 7 – Geometric Nonlinearities and Initial Stress

Chapter 8 – Contact Analysis

Chapter 9 – Current Conduction Analysis

Chapter 10 – Thermal-Electric Analyses

Workshop 1 – Thermal-Electric Analysis of  Thermal Actuator

Chapter 11 – Thermal-Mechanical Analyses

Workshop 2 – Thermal-Mechanical Analysis of Thermal Actuator

Chapter 12 – Electrostatic Analyses

Chapter 13 – Capacitance Extraction

Workshop 3 –  Capacitance Calculation for Comb-Drive Using CMATRIX

Chapter 14 – Electrostatic-Structural Coupling

Chapter 15 – Sequential Electrostatic-Structural Coupling

Chapter 16 – Direct Electrostatic-Structural Coupling Using TRANS126

Workshop 4 – Direct Electrostatic-Structural Simulations of Micromirror Using TRANS126 – Actuation and Hysteresis

Chapter 17 – Prestressed Modal Analysis

Chapter 18 – Residual Stress Induced by CTE Mismatch Among Materials

Workshop 5 –Thermal-Mechanical Analysis of Micromirror – Bending Due to CTE Mismatch

Chapter 19 – Pre-stressed Modal and  Pre-stressed Harmonic Analysis Using TRANS126

Workshop 6 –Prestressed Modal Analysis of Micromirror

Chapter 20 – Large Signal Time Transient Analysis Using TRANS126

Chapter 21 – Reduced Order Macro Modeling for System Level Simulation Using TRANS126

Chapter 22 – Transient Structural Analyses Using TRANS126

Chapter 23 – Two-Way Fluid Structure Interaction (FSI)

Workshop 7 – Two-Way FSI for Micromirror and Damping Characterization with Transient Structural Analyses

Chapter 24 – Piezoelectric Analysis

Workshop 8 – Piezoelectric Analysis of Touchscreen Device

Appendix A – Units System for MEMS Simulation

Typical Agenda

9:00AM – Class Begins

12- 1:00PM – Lunch Served

5:00PM – Class Ends

Cost: $600/day