Posts

Zuken & ANSYS — Easy Approach to PCB Design

Recently, Ozen Engineering has partnered with Zuken to offer customers a better and comprehensive solution to PCB design. By coupling Zuken CR-8000, a product-centric design platform which enables engineers/designers to have a superior and user-friendly PCB design experience in terms of minimized modeling procedures and powerful built-in PCB design library, with ANSYS Electromagnetic products – Siwave and Icepak, PCB designers are able to enjoy a revolutionized work experience at design level, and to simulate at another. ANSYS Electromagnetic products help designers verify their designs by analyze circuit EMI, power/signal integrity, temperature and heat transfer in IC packages and printed circuit boards. Really, you wouldn’t find a better match than Zuken and Ansys in the PCB field.

 

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Ozen Engineering 2018 Training

 

Dear valued OEI customers:

 

As the year 2017 is coming to an end, we would like to hear you out about any training requests for the following year so that we could arrange suitable schedules according to yours and ours. Here at Ozen Engineering, we offer varieties of training sessions covering multiple engineering topics: Fluids, Structures, Electronics, Systems, Multiphysics and Platform. Please check out our website to find your interests. Also, you can visit ANSYS website to find any advanced topics you wish us to cover, and our experienced engineers will prepare a customized session just for you!

 

ANSYS link:

http://www.ansys.com/services/training-center

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Seminar – Virtual Reality 3D Design Collaboration


  • July 21, 2017
    12:00 pm - 1:00 pm

Date:  July 21, 2017, Noon – 1PM (Eastern Daily Time) Location:  Mallett Technology office in Durham, NC  (address) Please join Ozen Engineering and Dr. Ali Merchant from iQ3Connect for this seminar. Human beings are visual, immersive thinkers… but why don’t we make products this way? When you and your team can interact hands-on with the design… (more…)

ANSYS HFSS 3D Layout


  • July 19, 2019
    9:00 am - 5:00 pm

Overview The ANSYS HFSS 3D Layout course for high-speed printed circuit board design focuses on layered structures using the 3D Layout design type in HFSS and AEDT (ANSYS Electronic Desktop). Designed for brand new users, this course covers layer stack-up, layout viewing, choices of solvers, ports, pad-stacks, and hierarchy. Workshops include small differential via structures, (more…)

Events

Seminar – Virtual Reality 3D Design Collaboration


  • July 21, 2017
    12:00 pm - 1:00 pm

Date:  July 21, 2017, Noon – 1PM (Eastern Daily Time) Location:  Mallett Technology office in Durham, NC  (address) Please join Ozen Engineering and Dr. Ali Merchant from iQ3Connect for this seminar. Human beings are visual, immersive thinkers… but why don’t we make products this way? When you and your team can interact hands-on with the design… (more…)

ANSYS HFSS 3D Layout


  • July 19, 2019
    9:00 am - 5:00 pm

Overview The ANSYS HFSS 3D Layout course for high-speed printed circuit board design focuses on layered structures using the 3D Layout design type in HFSS and AEDT (ANSYS Electronic Desktop). Designed for brand new users, this course covers layer stack-up, layout viewing, choices of solvers, ports, pad-stacks, and hierarchy. Workshops include small differential via structures, (more…)