Live Webinar:
Wednesday, June 25, 2025, 12PM PST
PCB Manufacturing and Reliability Considerations
A Closer Look at PCB Reliability — Led by Ansys Expert David Spitz
This technical webinar provides a comprehensive overview of Printed Circuit Board (PCB) manufacturing processes and dives into the key failure mechanisms that impact reliability in the field.
Topics Include:
- An introduction to PCB manufacturing flow
- Common failure modes and how to avoid them
- Pad cratering due to mechanical shock and vibration
- Conductive Anodic Filament (CAF) formation and prevention
- Through-hole via and micro-via reliability risks
- Best practices in design for reliability (DfR)
Date:
Wednesday, June 25, 2025 at 12PM PST
Duration:
60 minutes (45 minutes presentation + 15 minutes Q&A)
About The Speaker:
David Spitz is a Lead Consulting Engineer with Ansys Reliability Engineering Services (RES), bringing over 30 years of experience in PCBA manufacturing at top-tier contract manufacturers including Texas Instruments, Solectron, and Flex. Throughout his career, he has held key technical leadership roles spanning SMT engineering, DFM, and both NPI and high-volume production. His expertise includes BGA/CSP attachment, solder paste printing, SMT reflow soldering, and process optimization for long-term reliability.
