Videos > PCB Design Flow with ANSYS SI Wave and Zuken
Jan 17, 2019

PCB Design Flow with ANSYS SI Wave and Zuken

Welcome to today's webinar on PCB design flow using ANSYS SI Wave and Zuken. I'm Chris Cowan from Ozen Engineering. We specialize in physics-based simulation to solve multidisciplinary engineering problems, using CAE tools for finite element analysis and computational fluid dynamics. As an ANSYS channel partner and software distributor in California, we provide:

  • Software sales for ANSYS products
  • Training classes for ANSYS
  • Technical support for ANSYS products
  • Engineering consulting services

We operate in various fields including fluids, structures, mechanical, thermal, electronics, and multi-physics. Recently, ANSYS has added optics capabilities, and we are working in optics, wave protection, and resource delivery.

We also operate on the East Coast through partner companies Mallet Technologies and CADFEM in North Carolina, Maryland, and Michigan. This week's webinar focuses on PCB design flow, and we will be hosting a webinar every Wednesday for the next several months. You can register through the ANSYS website under events or through the Ozen Engineering website at ozeninc.com/training.

Without further ado, I'll turn this over to Steven.

Presentation by Steven Liu

Thank you, Chris. My name is Steven Liu from Ozen Engineering. Today's topic is the PCB design flow with ANSYS SI Wave and Zuken.

Introduction to PCBs

PCBs, or Printed Circuit Boards, are non-conductive boards that hold electronic components through circuitry. They are used in a wide range of industrial, commercial, and domestic applications. PCBs are the backbone of electronic devices and can be customized to any specification based on user requirements.

Types of PCBs

  • Single-sided PCBs
  • Double-sided PCBs
  • Multi-layered PCBs

PCBs can also be categorized based on:

  • Port style: Rigid, flex, hybrid
  • Parts perspective: Active parts (diodes, transistors, integrated chips), passive components (capacitors, resistors, inductors)
  • Package types: Surface mount, through-hole

PCB Design Flow

  1. Concept layout for the PCB
  2. Design the PCB layout
  3. Mechanical and electrical engineers branch off to work on their respective parts
  4. Assess cooling performance
  5. Optimize heat sink placement
  6. Import EDA PCB design

Using ANSYS SI Wave and Zuken, we can complete the PCB design flow without prototyping. For design, we use Zuken, and for simulation, we use ANSYS.

ANSYS SI Wave

ANSYS SI Wave is a tool for PCB simulation, focusing on signal integrity, power integrity, and electromagnetic analysis. It includes various solvers such as HFSS, Q3D Extractor, CPA, and PSI, and can be coupled with thermal solvers like IcePak.

The analysis capabilities include:

  • Signal integrity
  • Power integrity
  • DCIR drop analysis
  • EMI/EMC analysis
  • Decoupling capacitor optimization

Zuken CR8000

Zuken's CR8000 suite, particularly DesignForce, is a native 3D architecture that integrates with CAE tools. It allows engineers to prototype and conduct pathfinding studies in the same environment, reducing manual rework and improving design quality.

Conclusion

Thank you for attending today's webinar. We look forward to assisting you with your engineering challenges. For more information, please contact us at info@ozeninc.com or visit our website.

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Okay, I'll get started here. Thanks for joining everyone. Today's ANSYS webinar, we're going to be talking about PCB design flow using ANSYS SI Wave and Zuken. The presenter will be Steven An Anchong Liu from Ozen Engineering.

This is Chris Cowan, and I'm just giving a brief intro for a minute or two. So, my company is Ozen Engineering. We're a company focused on physics-based simulation to solve multidisciplinary engineering problems. We use CAE tools for finite element analysis and computational fluid dynamics.

Ozen Engineering is an ANSYS channel partner and software distributor in California, so we provide software sales for ANSYS products, training classes for ANSYS, and software sales for ANSYS.

We're a company focused on technical support for ANSYS products, technical support for our ANSYS customers, and we also provide engineering consulting services.

We operate in the fields of fluids using computational fluid dynamics, structures, mechanical and thermal using ANSYS mechanical, electronics, and multi-physics. Recently, ANSYS has added optics capabilities as well. So, we're working in optics, wave protection, and resource delivery.

We provide our end-to-end ECE safety systems as well. We offer support for artificial intelligence technology and provide virtual CAD power, video and photo for AI tools, video centers, and algorithms for satellite vehicles.

We operate in Sunnyvale, in the middle of the Silicon Valley in California, and on the East Coast through partner companies Mallet Technologies and CADFEM in North Carolina, Maryland, and Michigan. This week's webinar is PCB design flow.

We'll be hosting a webinar every Wednesday for the next several months. You can see the list of topics here. I'd like to invite you to join. You can register through the ANSYS website under events or through the Ozen Engineering website, ozeninc.com/training.

We'd like to be your partner, help you solve whatever engineering challenges that you have. Feel free to give us a call and we'll talk about how we can use simulation to attack the problem. You can contact us at info@ozeninc.com. You can call us or go to our website.

Without further ado, I'll turn this over to Stephen. Okay, thank you Chris. Thank you, Stephen. Okay, let's go ahead and hear from Stephen. Okay. My name is Stephen Liu. Again, I'm from Ozen Engineering. Today's topic will be the PCB design flow with ANSYS SI Wave and Zuken. Can everyone see this?

Yes. Okay. So, the main products we're looking at today are ANSYS SI Wave and Zuken CR- 8000. Before we get into the software, let's start with what are PCBs. PCBs are a non-conductive board that holds electronic components through circuitry etched onto it.

They can be built for a wide range of industrial, commercial, and domestic applications. Nowadays, we're emerging with electronic devices inside each of these electronic devices, there are thousands of components put together that enable specific desired functions.

Products range from high-end to low-end, from cell phones and computers to garage gate remotes and electric toothbrushes. It's safe to say that PCBs are the backbone of electrical devices and can be customized to any specification to meet user requirements.

In terms of types, we have single-sided PCBs, double-sided PCBs, and multi-layered PCBs. From a port style standpoint, we have rigid, flexible, and rigid-flex PCBs.

From a parts perspective, we have active parts such as diodes, transistors, and integrated chips, and passive components such as capacitors, resistors, and inductors. And we have pads, traces, vias, etc. In terms of package types, we can categorize PCBs into surface mount or through-hole.

There are different material options for the PCBs, such as substrate, conductor, adhesives, and more. Now, let's take a look at a typical PCB design flow. From step one, we start with a concept layout for the PCB. Then we move on to designing the PCB layout.

At step two, mechanical engineers and electrical engineers branch away to start working on their own portions of the project. For mechanical engineers, they will start to design the housing, packaging, or shell of the product.

Electrical engineers stay on the path to build electrical functionality that is designed into the product. Starting from step two, we enter step three, four, five, six, seven, where we assess the cooling performance on this PCB. At step three, we test the concept cooling strategy.

Then, at step four, we determine if a heat sink is needed. At step five, we optimize the heat sink by assessing the best location to put it. At step six, we import the EDA PCB design.

If we think one more step ahead, steps one and two are really the design stages, and steps three, four, five, and six are really the simulation stage. At the end of step six, we do a design review. So, all of these things we do with our CAD tools and our DXF files.

With the tools that I'm introducing today, the two tools that I'm introducing today, we can really complete this PCB design flow by just using two tools without actually prototyping. So, for design, we use Zuken, and for simulation, we use ANSYS.

Let's first take a look at the ANSYS side because we are an ANSYS distributor. This is the tool, this is the ANSYS tool, this is our ANSYS solution for PCB simulation. It's called SI-Wave. It's a very simple tool. On this slide, we're looking at the general desktop of SI-Wave.

On the left side, we have the NETS library. Right now, we're looking at single-ended NETS. The one good thing about this tool is that it can automatically recognize the NETS, single-ended, double-ended, and different NETS. So, it's really easy to recognize the NETS.

Let's take a look at the NETS library. So, we're going to go to the tools, NETS library. There, we can see the video. And lastly, we have SKU. This is the main content file that you can access. The other files that you can adjust are the schematic, the layout, and the simulation setup files.

This is what it is basically. It's essentially like an integrated HDL or lowering and doubling of data flexibility. It's an electromagnetic-based software solution for power integrity, grounding, and signal integrity analysis.

It employs a powerful full-wave analysis engine to generate both frequency domain and time domain results using a highly optimized internal field solver. SI-Wave simulates complete board package design with full-wave accuracy.

Information results can be reported graphically using advanced 2D and 3D plotting methods. So, it's really a platform. It's a platform with numerous solvers built in that you can choose from. It has, for field solvers, we have HFSS, which is another flagship product.

It also has a Q3D extractor for parasitic and electrostatic analysis. Also, CPA and PSI, which is SI-Wave's unique solver. It can also be coupled with thermal solvers, such as IcePak, another ANSYS product that specifically deals with electronic cooling.

It also includes circuit solvers, such as NAXIOM and Synopsys or HSPICE.

Based on these solver capabilities, the type of analysis we can perform in SI-Wave includes signal integrity, power integrity, DCIR drop analysis, EMI, EMC, decoupling capacitor optimization, and PSPICE, HSPICE, and Spectra circuit analysis. So, that's all for today. Thank you.

And I'll also let Steven give us the boil-down content, whether they make it up at the DRN.

And we can hear into more detail further shoes on DLP4, uniforms, and operating management processes in disconnecting from television and pumping direct water into the public places and putting far for eight Te purchased abal side to make up which by in and of itself take shape to normalize-post charge.

A lot of the focuses in the PCB industries is to assess the signal and power integrity performance. What is signal and power integrity?

Basically, it determines if a signal transmitted from point A as a logic level 1 will be received correctly at point B as a logic level 1. With that being said, if a poor signal integrity or power integrity design creates electronic noise that can become EMI, proper replacement of decoupling capacitors and routing of signals removes this noise.

So, specifically for power integrity and signal integrity, the SI-Wave has these listing core solvers to tackle the problem. For power integrity, we can utilize 3D DCR solver with adaptive mesh refinement.

And speaking of mesh refinement, it's another, I would say, flagship technology within the ANSYS Electronics. So, we have a lot of electronic solvers that are available in the ANSYS Electronics suite with the EPU product.

But mesh refinement means that the mesh, so first of all, in the electronics product, engineers and users don't need to do the mesh manually. It always creates mesh on its own. And you can specify the fineness of the mesh without actually doing the mesh. And you can specify a number of paths.

So, the mesh, originally, the mesh was machine computed because the mesh was wired or connected. And then we applied the mesh circuits to perpetual led feedback or electrical performance colors withstanding electronic devices to create Industrial Proximity waves.

Over time, we have 20,000 Huawei models, and we developed a weddings and we've got radiant on the significant parts and components where we care about so that the results will be more accurate.

So, if we continue on this slide, we have other solvers for power integrity such as 2.5D and 3D field solvers that give you XYZ parameters on signal integrity, we can do impedance and cross-section scans for PCB and packages, and it could also be done for XYZ using XYZ solvers for a fast and high capacity hyper solver.

We also have a signal net analyzer that does impedance and flight time solves. SI Wizard is especially created for the signal integrity so that we can provide you with I diagrams to determine whether we have a good or bad signal integrity on the top. I just showed you the ribbon menu style.

We recently have a simulation tab that has many different modules and functionalities.

SI Wave as a product comes with three different packages starting from the most left with SI Wave DC with DC capabilities as well as links for EDA, it's the ECAT translation which we will talk about a little more later, the DC analysis mostly focused on low voltage high current PCBs and IC packages enabling assessment of critical and to end voltage margins to ensure reliable power delivery, it would also allow you to perform a pre and post-layout what-if analysis for DC voltage drop, DC currents, and DC power loss.

And then we step one level up, we have a SI Wave PI package, it includes everything that the DC package has, and it also adds AC analysis to accurately model power delivery networks and noise propagation on PCBs, it's this package is ideal for analyzing power integrity distribution challenges and automatically optimizing decoupling capacitor selection and placement.

And with one step above, we have the comprehensive SI Wave package that does almost everything we just mentioned before and also has SI circuit that includes IBUS and IBUS AMI component library, it also has and one key thing that this thing that this package have is the robust and ANSYS Nexium time domain circuit simulation engine so that it would enable the fast impedance and crosstalk scanning with visual and color-coded feedback in HTML reports.

So, on that's the different packages we provided with SI Wave. If you have other abilities that you have options of, please share in the chat and share some recommendations. So, you're welcome to share if you have any further questions or if you need any of your favorites.

The psycho and up channels that we provide these six chips on this project and these are specific Khw brain workbench and really metal and then the weak then rust is Bayern lead this dry metal and course solution like light and cold and you can your foolish which is your blemish an analysis switch with such quantum right side we have ice pack which is something will mention before that's a electronic cooling product well, once you invoke the Erskine version, we have here an upgrade to dry andleikas and you know, if you have – especially with the ice pack, it's – you can invoke – you can do a temperature – you can do a dual heating and temperature simulation that – so that you can bring the dual heating data and the temperature mapping to ice pack to help you do an electronic cooling solution.

So, by doing so, the closed-loop calculation, this SI wave coupling with ice pack, can – gives you successful insight into the thermal behavior of key PCB sections. We also mentioned a little bit about the E-CAT translation before.

If you are a user for this program, you can use the E-CAT translation to do a thermal analysis. It's a very useful tool. It's a very useful tool. If you are a user for this program, you can use the E-CAT translation to do a thermal analysis. It's a very useful tool.

You definitely would care about what kind of – what type of E-CAT database it can bring. Good thing is the SI wave recognizes most of the nowadays vendors' file format.

From Cadence, it can recognize Allegro, APD, SIP Digital, Veroso, for metal graph, and most of the metal graphics, as well as the ODP++. Of course, Zuken as well.

So, with all these translations, SI wave provides seamless and integrated design flow that allows you to import layout geometry from major E-CAT providers, easily import design geometry from commercial layout packages, such as designer, SI, you know, and other applications.

So, it's a very useful tool. It's a very useful tool. It's a very useful tool. And it's also a very useful tool for post-processing. This slide is a table format of the previous two slides. It basically summarizes the capabilities in different SI wave packaging. Okay. All right.

So, one thing newly added to the capabilities is this IRAM Python, and also the Synopsys HSPICE, Cadence PSPICE are also newly added as well. Everything else we have mentioned a little bit before. So, this is a – this page is a highlight of the – of the course.

So, if you have something in your database, you can go to this page and you can go to the page and you can find the files. The last version of SI Wave update list. However, in this year, by the end of January, all customers should be able to access the new ANSYS 2019 R1 version release.

We'll have a follow-up presentation on that. On this page, it's some simple results that I generated from SI Wave. The first one on the left upper corner is the resonance mode. On the right upper corner, it's DCIR drop of current density on the product.

On the lower left, it's PCIe card power distribution. And on the lower right, it's PCIe card power loss mapping. Now let's take a quick look at SI Wave. So right now, there's already a PCB open. I can do this one more time. I will start a new project. So, this is the general look of the SI Wave.

We have a ribbon style, which is very user-friendly. Here, it enables you to import different kinds of ECADs, EDAs, and other imports. We have home, review, pools, advanced. You can export. By the way, the SI Wave can export the design or the project into other ANSYS products, as I mentioned before.

You can export it or design to HFSS3D, which is sort of a slightly variation of the standard HFSS. We can also export it to Q3D. Export it to Maxwell 3D to a power simulation and also IcePak for electronics cooling. And as we saw before, there's different simulation that you can perform under here.

And also, we can take a look at the different performance results on the project. Now, let's open a board that I just created, that I generated from Zuken. So, we do an import and ANSYS neutral file.

This is the neutral file that's exported from Zuken DesignForce, which is another software we're going to talk about in a minute. So, after the import, we'll ask you for configuration, just for you to check if all the net names are correct as you designed.

Once you have it imported, there's a little bit of a delay. So, you can see that we have a lot of changes in the design. So, you can see that we have a lot of changes in the design. And we're going to go ahead and import it.

There is a SI Wave workflow wizard that allows you to, gives you the option to do an automatic verification for stack up, pass text, or circuit element parameter.

The whole purpose of this wizard is, it's optional for the users, but it's definitely a good tool to help the users to verify their designs or import. See if anything is missing, everything is correct. See if anything is missing, everything is correct. If the via or stack up is correct.

So, we'll skip this step. And now we have this board imported. It looks a little strange because the Z direction is stretched. Okay, with this open, we can do a lot of analysis on it. Okay, with this open, we can do a lot of analysis on it. I will skip showing you with the Z direction.

I will skip showing you with the Z direction. I will skip showing you with the Z direction. I will skip showing you with the Z direction. I will skip showing you with the Z direction. I will skip showing you with the Z direction. I will skip showing you with the Z direction.

Just directly show you the results. Just directly show you the results. Just directly show you the results. So, here, as you can see, I did some simple analyses on the DCIR simulations. So, here, as you can see, I did some simple analyses on the DCIR simulations.

Now, this map is showing you current density. On every layer, basically everywhere on the PCB. On every layer, basically everywhere on the PCB. On every layer, basically everywhere on the PCB. Were on the PCB. Of course, you can unselect them just looking at one layer or all of them.

And there's also via current to allows you to see the current going through the Vias. That also allows you to look at the voltage mapping on the board and also power distribution on the PCB as well.

And I believe, I haven't done this yet, but this is exactly the power mapping that I'm talking about so that you can send it to ice pack for electronics cooling. There's also impedance scan to scan different all of the nets on the PCBs to see if there is any violations.

The rules are set by yourself. You can set the warning tolerance at 10% or violation tolerance at 20%. You can also change it to 20%, 30%. That's really how you want to have your rules set up. And of course, also crosstalk scan. Something just pops up.

You can also do a resonant mode simulation that gives you different frequencies.

It allows you to plot voltage difference between planes. 0. 001. If you want to do a face animation, say, on the conductive layer one and two, if we want to do a face animation, you can tell the difference of different...You can tell the voltage difference between the planes basically.

So, there's a lot more to explore. If you are interested, ask... Contact us for more information. 0. 001. for more information. So now we would talk, I'd like to talk a little bit about Zuken.

So, as Chris introduced before, we are ANSYS distributors, but also as channel partner, as a consulting company, we're partnering with Zuken America to sell this Zuken product as well.

So, the key features and the benefits as listed here, the number one is Zuken and ANSYS have a strong partnership and roadmap for simulation.

And it also, the Zuken define a store simulation parameters and a model information in design force, which is the product that we are that we do this design at. The whole suite of this product is called CR 8000. And there's a couple different products in it.

And then the main product is called DesignForce. So, with DesignForce, as you can see, it can be coupled with ANSYS Simplorer to allows you to do a system load, for a high level electromechanical logic simulation.

And as you can see, it can export into ANS or EDV or step files so that it can be passed to different ANSYS solutions, such as HFSS, ISEPAC, Mechanical, et cetera. So, most of these connections are bi-directional, so that, you know, so that the users can reduce manual rework.

So, DesignForce, as we are talking about, is a native 3D architecture that enables direct integration of CAE tools. Zuka is now collaborating with best-in-class CAE companies for direct integration.

Some of the target benefits they're looking at is allow engineers to prototype or conduct pathfinding studies in the same environment for production design, eliminate wasted and error-prone handoffs in design process, motivate all members of the design process to co-simulation across design process to improve design quality and save costs of design respins.

So, there's... This is the collaboration summary with best-in-class CAE tools that Zuka has been partnered with. So, without further ado, let me quickly show you a YouTube video on DesignForce. So, this is a capability within DesignForce where you can switch between 2D and 3D view.

And you can do the trace mapping either in 2D or 3D view. So, this is a capability within DesignForce where you can switch between 2D and 3D view. And you can do the trace mapping either in 2D or 3D view.

So, this is a 3D technology editors screen so that you can look at the layers from a different perspective. And it's also a... This design tool is also a multi-level design tool so where you can map the traces across the layers.

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But yeah, if any of you guys are interested in more information, feel free to reach me. And this is about it for today's webinar. Thanks everybody for your attention. We're looking forward to seeing you in the future. And have a nice day.