AEDT Icepak and Electronics Cooling Analysis: Part 2
Welcome to part 2 of our video series, where we discuss the applications of AEDT Icepak in solving an electronics cooling problem. In part 1, we developed a geometry featuring:
- Electronics cooling with two fans
- An enclosure
- A grill
- A heat sink
- Heat-generating components
We also utilized network modeling for our bridge and AGP cooling. The next steps involve meshing, running, and post-processing our model.
Meshing the Model
With the domain and setup ready, we proceed to meshing:
- Click on Simulation and select Global Mesh Settings.
- Select a fine mesh quality, which means a large count of cells, and click OK.
- Click on the Generate Mesh button.
Track the meshing progress in the progress window. Depending on the complexity of the geometry and mesh count, this step can take time. For our model, it completed within 20-30 seconds.
Once meshing is complete, check the mesh quality using cut planes and ensure:
- Minimum quality is above 0.05 (0.18 in our case is good).
- No negative volumes.
- Skewness is over 5%.
Setting Up Monitor Points
For a CFD run, it's crucial to track key properties at different iterations. Temperature is a key parameter, so we add monitor points:
- Right-click on Arch Flash, select Assign a Monitor, and choose a point for temperature monitoring.
- Repeat for other components, such as DDRs.
Running the Simulation
To start the solution process, you can:
- Click Analyze All directly.
- Go to Analysis and select Analyze All or Icepak.
Monitor the progress window to ensure the model is created and read into Fluent without errors. If setup and meshing are correct, execution will start, showing iteration numbers as the solution progresses.
Monitoring Solution Progress
During the run, observe the following:
- Iteration numbers and equations being solved.
- Residuals graphically represented, aiming for four orders of magnitude for continuity.
- Temperature monitors, initially fixed at 20, as the energy equation is solved after flow and turbulence.
Post-Processing
Once the run is complete, proceed with post-processing:
- Go to Field Summary under Results to get numerical values.
- Check volumetric values for components like the board and DDRs, focusing on temperature.
- For network temperatures, select Boundary and Surface to view AGP and bridge network temperatures.
Use contour and vector plots for visual analysis:
- Select an object, right-click, and choose Plot Fields of temperature.
- Analyze flow distribution and velocity vectors to assess cooling efficiency.
Saving and Sharing the Model
After completing the analysis:
- Click Save Project to save your model.
- Use File > Archive to share the model with others, ensuring all data is included.
Thank you for following this presentation on AEDT Icepak and electronics cooling analysis.
AEDT Icepak and Electronics Cooling Analysis: Part 2 Welcome to part 2 of our video. Today, we'll talk about AEDT Icepak and its applications to an electronics cooling problem. In part 1, we developed a geometry with electronics cooling, including two fans, an enclosure, a grill, and a heat sink.
We also used network modeling for our bridge and AGP cooling. Now, it's time to mesh, run, and post-process our model. Since the domain and setup are ready, let's start with meshing.
Click "Simulation," then "Global Mesh Settings." Select "Fine Mesh Quality" for a large count of cells, then hit "OK" and "Generate Mesh." Track the progress in the window. In this problem, it should take 20-30 seconds.
Once it's done, check the number of elements and look at the mesh using cut planes. Ensure the minimum quality is 0.18 or higher, there are no negative volumes, and skewness is over 5%.
If satisfied, hit "Close." Before starting the solution process, define monitor points for key parameters, such as temperature. To do this, go to "Arch Flash," right-click, assign a monitor, and select a point. Add monitors to other components as needed. Now, start the solution process.
Click "Analyze All" or "Ice Pack." During execution, track the progress in the window. When complete, check the residuals and temperature solution. For post-processing, get numerical values using "Field Summary" under "Results." Look at volumetric values, such as board and DDR temperatures.
For network temperatures, select "Boundary," then "Surface" to see the AGP and bridge networks. To view the junction temperature, create a vector plot for the heat sink and plot temperature.
This will show the temperature distribution and suggest possible improvements, such as changing fan or AGP positions. Another interesting piece of information is the flow distribution. Use "Plot Fields" and "Velocity Vectors" to see the flow field around objects.
When finished, save and archive your model for sharing with others. That concludes our presentation. Thank you.
