Improving Electronics Reliability: Mechanical Reliability

Good morning, good afternoon, everyone. Thank you for joining us in today's webinar. We are going to talk about mechanical reliability, which is part of the series on ANSYS solutions to help improve electronics reliability.

Electronic systems are found in nearly all industries, such as aerospace, automotive, consumer electronics products, healthcare, industrial, and many others. Ensuring these systems remain operational and perform their intended functions in a variety of environments is critical to product success.

Companies who properly address electronics reliability concerns, especially through simulation, can meet any of the objectives stated in this slide. Traditionally, companies have used a design, build, test, break, fix it kind of design cycle.

However, such an approach can be expected to present a product with a long-lasting solution from an afar to any input. We offer cutting-edge products by using simulations, specifically ANSYS solutions, which allow virtual models and prototypes to be created and simulated in virtual testing.

This helps provide engineers with a higher degree of confidence that the physical tests they do run will be successful. ANSYS provides a suite of tools and workflow solutions that address a wide range of electronics reliability concerns.

Each aspect, including electrical, thermal, mechanical, multi-physics, and reliability physics analyses, plays a key role in the understanding of how electronic systems operate and perform in a variety of situations. We did the electrical reliability webinar on June 9th.

The recording is available if you are interested. Last week, we did thermal reliability. This week, we are doing mechanical reliability. And next week, we are going to talk about comprehensive multi-physics solutions. The week after next, we are going to talk about reliability physics analysis.

Please sign up for these. I'm going to give you a link to the website. Today, we will focus on mechanical reliability. Physical structures, such as PCBs and other electronic components, are susceptible to failures due to excessive deformation or warpage.

This may be from thermal loads and excessive shock, vibration, or drop. ANSYS has solutions to address these concerns one by one. We can do tumble test simulations, drop test simulations, moisture simulations, heat transfer simulations, and address solder joint reliability.

In this webinar, we will talk about how we can take into account all these details in our models, including traces and coatings on their fields. They all play a role in either enhancing or decreasing the fatigue life.

When it comes to mechanical reliability, the simulation challenges include geometric complexity, material complexity, and physics complexity. ANSYS tools have the best-in-class PCB modeling capabilities, including lump mass modeling, trace mapping, reinforcements, and trace modeling.

These options provide a range of simulation speed and accuracy to address the complexities of PCB modeling. Detailed component modeling, including wire bonds, solder, leads, traces, vias, heat sinks, and underfields, can be accounted for using ANSYS's capabilities.

WarpWitch simulations, solder reflow simulations, step-by-step assembly process simulations, shock and vibration simulations, drop test simulations, and moisture effects simulations can all be done using ANSYS tools.

The solder reflow process is important for capturing the solidification and final shape of solder joints to do accurate fatigue simulations. ANSYS Fluent can be used for solder reflow simulations to affect package or PCB WarpWitch calculations and predictions.

ANSYS provides a range of capabilities for modeling and simulating various aspects of electronics reliability, including shock and vibration, moisture effects, drop tests, and solder joint reliability.

These capabilities can help predict the behavior of electronic systems over time and reduce costs associated with physical testing by running simulations to explore and validate design solutions.