ANSYS Wireless Communications

Empowering the Internet of Things (IoT) by Simulation

According to a recent report from the McKinsey Global Institute on the future of disruptive technologies, IoT figures prominently as one of the “next big things” that is bound to transform life, business and the global economy in the years to come. The report suggests huge implications for IoT by 2025, with a potential economic impact estimated to be from $2.7 trillion to $6.2 trillion per year. Technology companies are investing heavily in IoT and creating devices with widespread applications.

IoT is a collection of a number of devices connected to the internet. At the heart of these devices are integrated circuit chips. It is not only daunting to build complex circuits from scratch, but it also requires a lot of effort, time, and millions of investment dollars. With so much at stake, simulation driven tools become critical for engineers, empowering them to create the IoT and make it reliable, inexpensive and energy efficient. The main design challenges include high network speeds and low power budgets. ANSYS SIwave and Q3D Extractor help to meet these challenges by simulating complex circuit boards and packages used in IoT applications, thus cutting down on build and test cycles, reducing the number of prototypes and finding errors before these products hit the market. The design philosophy necessitates squeezing more and more transistors into a smaller package and reducing voltage supplies to meet shrinking power budgets. To address these challenges, SIwave and Q3D are equipped with powerful solvers and user interfaces.

ANSYS 16.0 includes major improvements to streamline the user’s workflow, speed up the simulations and help identify problem areas in a design. These major enhancements and features include:

  • A New ribbon user interface for SIwave
  • Signal Integrity and Power Integrity workflow wizards to increase customer success
  • Push-button time-domain and DC analysis
  • Trace Zo Scan to identify problem spots
  • Fast distributed AC inductance solver for Q3D