For more than a decade, leading companies around the world have relied on Ansys Icepak to provide robust and powerful computational fluid dynamics (CFD) software for electronics thermal management. Based on the state-of-the-art Ansys FLUENT CFD solver, Ansys Icepak software has a streamlined user interface that speaks the language of electronics design engineers, enabling the rapid creation of models of complex electronic assemblies. The software automatically generates highly accurate, conformal meshes that represent the true shape of electronic components, and simulations include fluid flow and all modes of heat transfer – conduction, convection and radiation – for both steady-state and transient thermal-flow simulations. By predicting fluid flow and heat transfer at the component, board or system level, Ansys Icepak improves design performance, reduces the need for physical prototypes and shortens time-to-market in the highly competitive electronics industry.
Flexible, Automatic Modeling
Interface to Structural Simulation
Robust Numerical Solutions
Technical Seminar/Hands-On Events
Ozen Engineering Inc. holds Ansys Technical Seminars and Hands-On Training every month. Classes are taught by Ozen Engineering experts who have extensive Ansys application experience as well as FEA and CFD computer-aided engineering expertise. To see our events schedule or register for an upcoming event, please go to our Events page.