Industry Spotlight Solder Joint Reliability

BGA Reliability Outputs

In the design of Ball Grid Array (BGA) packaging design, solder joints are a frequent critical area; they are the weak links. In this webinar, we will talk about how to improve the robustness and reliability of these parts using the capabilities of Ansys Multiphysics simulations. The topics covered in this webinar are:

Fracture Mechanics Approach
Fatigue
Creep versus Viscoplasticity
Thermal Cyclic Modeling for the Calculation of Accumulated Fatigue
Damage (Darveaux Model)
Some Design/Analysis Guidelines

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Ozen Engineering, Inc.

Prestigious companies in California turn to Ozen Engineering as the single-source of reliable simulation solutions. Although Ozen Engineering is headquartered in the heart of Silicon Valley, we collaborate with best-in-class companies worldwide to optimize product design performance and improve product development processes for our clients wherever they are located and across a wide variety of industries. We are dedicated to supporting our clients. We are passionate about developing accurate simulation and realistic modeling as core competencies within client companies and helping them realize unparalleled results from their FEA, CFD and Electromagnetics investments.