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Industry Spotlight Solder Joint Reliability

BGA Reliability Outputs

In the design of Ball Grid Array (BGA) packaging design, solder joints are a frequent critical area; they are the weak links. In this webinar, we will talk about how to improve the robustness and reliability of these parts using the capabilities of Ansys Multiphysics simulations. The topics covered in this webinar are:

  • Fracture Mechanics Approach
  • Fatigue
  • Creep versus Viscoplasticity
  • Thermal Cyclic Modeling for the Calculation of Accumulated Fatigue
  • Damage (Darveaux Model)
  • Some Design/Analysis Guidelines

Have a Question? Need more information? Please do not hesitate to contact us.

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