- August 7, 2019
11:00 am - 12:00 pm
Failure in electronics can occur through multiple physical mechanisms. Oxide breakdown in FETs/MOSFETs, Current leakage, Degradation in electrical performance due to change in properties, Electromigration, Stresses due to TCE mismatch, Corrosion, almost all of the above failure mechanisms are enhanced at higher temperatures.
At 2019 R1 release, two-way electrothermal workflow is available in AEDT. It is valid for HFSS, Maxwell and Q3D design types, utilizing thermal modifier for materials and temperature feedback in EM design