MEMS Multiphysics Simulations

  • September 19, 2017 - September 20, 2017
    9:00 am - 5:00 pm
  • May 10, 2018 - May 11, 2018
    9:00 am - 5:00 pm
  • May 16, 2019 - May 17, 2019
    9:00 am - 5:00 pm

Overview

MEMS Multiphysics Simulation:  The course focuses on coupled physics simulation methods and techniques for common MEMS devices, such as: thermal-electric actuators, comb drive resonators, micromirrors, switches, and piezoelectric actuators.

The course also includes relevant “hands-on” workshops and exercises.

 

Full MEMS Agenda

Chapter 1 – Introduction to Multiphysics Simulation for MEMS

Chapter 2 – ANSYS Multiphysics

Chapter 3 – Multiphysics Simulation

Chapter 4 – Sequential Coupled-Field Simulations

Chapter 5 – Direct Coupled-Field Simulations

Chapter 6 – Coupled-Field Elements

Chapter 7 – Geometric Nonlinearities and Initial Stress

Chapter 8 – Contact Analysis

Chapter 9 – Current Conduction Analysis

Chapter 10 – Thermal-Electric Analyses

Workshop 1 – Thermal-Electric Analysis of  Thermal Actuator

Chapter 11 – Thermal-Mechanical Analyses

Workshop 2 – Thermal-Mechanical Analysis of Thermal Actuator

Chapter 12 – Electrostatic Analyses

Chapter 13 – Capacitance Extraction

Workshop 3 –  Capacitance Calculation for Comb-Drive Using CMATRIX

Chapter 14 – Electrostatic-Structural Coupling

Chapter 15 – Sequential Electrostatic-Structural Coupling

Chapter 16 – Direct Electrostatic-Structural Coupling Using TRANS126

Workshop 4 – Direct Electrostatic-Structural Simulations of Micromirror Using TRANS126 – Actuation and Hysteresis

Chapter 17 – Prestressed Modal Analysis

Chapter 18 – Residual Stress Induced by CTE Mismatch Among Materials

Workshop 5 –Thermal-Mechanical Analysis of Micromirror – Bending Due to CTE Mismatch

Chapter 19 – Pre-stressed Modal and  Pre-stressed Harmonic Analysis Using TRANS126

Workshop 6 –Prestressed Modal Analysis of Micromirror

Chapter 20 – Large Signal Time Transient Analysis Using TRANS126

Chapter 21 – Reduced Order Macro Modeling for System Level Simulation Using TRANS126

Chapter 22 – Transient Structural Analyses Using TRANS126

Chapter 23 – Two-Way Fluid Structure Interaction (FSI)

Workshop 7 – Two-Way FSI for Micromirror and Damping Characterization with Transient Structural Analyses

Chapter 24 – Piezoelectric Analysis

Workshop 8 – Piezoelectric Analysis of Touchscreen Device

Appendix A – Units System for MEMS Simulation

Typical Agenda

9:00AM – Class Begins

12- 1:00PM – Lunch Served

5:00PM – Class Ends

Cost: $600/day