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June 16, 2016 10:30 am - 12:00 pm
Lunch & Learn –
Electronics Thermal Management
June 16, 2016
11:30AM – 1:00PM (lunch provided)
Upon completion of this event, attendees are eligible to receive a
14-day evaluation license.
Join us for this upcoming lunch & learn event featuring Electronics Thermal Management!
Thermal management and thermal stress are two very important parts of analysis for electronics products but are often parallel, unrelated processes. Ansys R17 offers new functionality for more fully resolving the ECAD detail in a thermal stress analysis. In this seminar see how the Ansys Workbench platform allows quick and easy transfer of Ansys Icepak thermal conditions into a Ansys Mechanical structural analysis, allowing a fully detailed thermal stress analysis.
Prestigious companies in California turn to Ozen Engineering as the single-source of reliable simulation solutions. Although Ozen Engineering is headquartered in the heart of Silicon Valley, we collaborate with best-in-class companies worldwide to optimize product design performance and improve product development processes for our clients wherever they are located and across a wide variety of industries. We are dedicated to supporting our clients. We are passionate about developing accurate simulation and realistic modeling as core competencies within client companies and helping them realize unparalleled results from their FEA, CFD and Electromagnetics investments.