Lunch & Learn – Electronics Thermal Management

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  • June 16, 2016
    10:30 am - 12:00 pm
Lunch & Learn –

Electronics Thermal Management

June 16, 2016

11:30AM – 1:00PM (lunch provided)

Upon completion of this event, attendees are eligible to receive a

14-day evaluation license.

 

Join us for this upcoming lunch & learn event featuring Electronics Thermal Management!
Thermal management and thermal stress are two very important parts of analysis for electronics products but are often parallel, unrelated processes. Ansys R17 offers new functionality for more fully resolving the ECAD detail in a thermal stress analysis. In this seminar see how the Ansys Workbench platform allows quick and easy transfer of Ansys Icepak thermal conditions into a Ansys Mechanical structural analysis, allowing a fully detailed thermal stress analysis.