- May 15, 2019
11:00 am - 12:00 pm
ANSYS HFSS can utilize ready-made 3D component models for simulation. These components include antennas, radio frequency (RF) connectors and surface-mount devices (e.g., chip capacitors and inductors). A 3D component model contains all relevant information: geometry, materials, boundary conditions, design parameters and ports (when necessary), for inclusion in a fully coupled, 3D electromagnetic simulation. In addition, a patented encryption technology allows component providers to hide and protect critical intellectual property (IP), while fully describing their parts for downstream simulation. The benefits of using 3D components range from design reuse to collaboration enablement with vendors, partners or customers.