Introduction to BGA-Solder Joint Reliability Simulation

We're sorry, but all tickets sales have ended because the event is expired.
  • August 26, 2015
    8:00 am - 4:00 pm
  • July 3, 2020
    8:00 am - 4:00 pm
  • July 5, 2019
    8:00 am - 4:00 pm


In the design of Ball Grid Array (BGA) packaging design, solder joints are a frequent critical area. Learn how to improve the robustness and reliability of these parts using the capabilities of ANSYS multiphysics simulations.

The topics covered in this course are:

  • Fracture Mechanics
  • Fatigue
  • Creep versus Viscoplasticity
  • Thermal Cyclic Modeling for the Calculation of Accumulated Fatigue
  • Damage (Darveaux Model)
  • Design/Analysis Guidelines

This is a 1-day class. Each topic is followed by “hands-on” workshops and exercises.

Typical Agenda

9:00AM – Class Begins

12- 1:00PM – Lunch Served

5:00PM – Class Ends

Cost: $600/day