• June 19, 2018 - June 20, 2018
    9:00 am - 5:00 pm

Overview Multiphase flows are often playing a key role in industrial processes. Understanding of multiphase related phenomena is important to optimize process or products. Multiphase models in ANSYS Fluent are able to capture a large range of multiphase aspects in CFD simulation helping to understand your multiphase application. This course combines theory of multiphase flows (more…)


  • June 21, 2018
    9:00 am - 5:00 pm

Human beings are visual, immersive thinkers… but why don’t we make products this way? When you and your team can interact hands-on with the design… walk around it with your feet instead of a mouse… only then will you see it the same way as customers. When your team members can see the product this (more…)


  • June 21, 2018
    11:00 am - 1:00 pm

Ozen Engineering invites you to attend our lunch & learn event, in which we will introduce a new PCB design work flow featuring industry-leading tools from Zuken and ANSYS.   Design and simulation are two important aspects in the creation of new products and it can be difficult to separate one from the other. As (more…)


  • June 22, 2018
    9:00 am - 5:00 pm
  • July 20, 2018
    9:00 am - 5:00 pm
  • August 9, 2018
    9:00 am - 5:00 pm
  • September 21, 2018
    9:00 am - 5:00 pm
  • October 12, 2018
    9:00 am - 5:00 pm
  • November 8, 2018
    9:00 am - 5:00 pm
  • December 7, 2018
    9:00 am - 5:00 pm

Overview ANSYS CFD (Fluent and CFX) software contains the broad physical modeling capabilities needed to model flow, turbulence, heat transfer, and reactions for industrial applications ranging from air flow over an aircraft wing to combustion in a furnace, from bubble columns to oil platforms, from blood flow to semiconductor manufacturing, and from clean room design (more…)


  • June 26, 2018 - June 28, 2018
    9:00 am - 5:00 pm
  • September 25, 2018 - September 27, 2018
    9:00 am - 5:00 pm

  Overview ANSYS Icepak provides flow and thermal management solutions for many types of electronic design applications. The primary goal of this course is to cover the basics of working in the ANSYS Icepak user environment. Students will be introduced to the world of electronics thermal modelling through a combination of lectures, workshops and examples/demonstrations. (more…)


  • July 5, 2018
    9:00 am - 5:00 pm
  • October 30, 2018
    9:00 am - 5:00 pm

Overview ANSYS SpaceClaim Direct Modeler (ANSYS SCDM) software is a new way to build and manipulate CAD models. The model becomes completely dynamic, allowing the user to move, stretch, add and remove with mouse movements. All changes to the CAD model occur in real time on the screen, providing instant feedback on a design. This (more…)


  • July 6, 2018
    9:00 am - 5:00 pm

Overview This one day training course will demonstrate the fully automated 3D electrical layout interface enabled in ANSYS HFSS 15. Course Description As a complement to the traditional arbitrary 3D CAD-based modeling interface, the HFSS 3D Layout interface is a significant productivity enhancement for IC Package and PCB designers. HFSS 3D Layout allows engineers to (more…)


  • July 10, 2018 - July 11, 2018
    9:00 am - 5:00 pm
  • August 1, 2018 - August 2, 2018
    9:00 am - 5:00 pm
  • September 4, 2018 - September 5, 2018
    9:00 am - 5:00 pm
  • October 2, 2018 - October 3, 2018
    9:00 am - 5:00 pm
  • November 6, 2018 - November 7, 2018
    9:00 am - 5:00 pm
  • December 4, 2018 - December 5, 2018
    9:00 am - 5:00 pm

Overview ANSYS Mechanical provides solutions for many types of analyses including structural, thermal, modal, linear buckling and shape optimization studies. ANSYS Mechanical is an intuitive mechanical analysis tool that allows geometry to be imported from a number of different CAD systems. It can be used to verify product performance and integrity from the concept phase (more…)


  • July 12, 2018
    9:00 am - 5:00 pm
  • September 6, 2018
    9:00 am - 5:00 pm
  • November 9, 2018
    9:00 am - 5:00 pm

Overview This one-day course uses examples and exercises to provide a comprehensive understanding of HFSS, intended for people who have had little or no experience with ANSYS HFSS. The ANSYS HFSS course will teach the students how to design and analyze high-frequency electronic components such as antennas, RF/microwave components, and biomedical devices. The course will (more…)


  • July 13, 2018
    9:00 am - 5:00 pm

Overview In the design of Ball Grid Array (BGA) packaging design, solder joints are a frequent critical area. Learn how to improve the robustness and reliability of these parts using the capabilities of ANSYS multiphysics simulations. The topics covered in this course are: Fracture Mechanics Fatigue Creep versus Viscoplasticity Thermal Cyclic Modeling for the Calculation (more…)