Ansys Autodyn Explosive Simulations

YouTube Video Series: Explosive Simulations Using Ansys Autodyn

If you are trying to simulate explosions, Ansys Autodyn is a great simulation tool.

To aid users in setting up and solving 2D and 3D simulations, check out our three-part YouTube videos that walks the user through the workflow needed using Ansys Autodyn as well as Ansys Workbench and the traditional Ansys GUI. Both 2D and 3D models are discussed.


This short video shows the workflow for setting up a 2D multi-material Euler simulation. 2d simulations are very fast and allow engineers to rapidly iterate.

 


Ansys Autodyn makes setting up and running 3d explosion simulations easy. However the traditional GUI is so powerful that it is often a good idea to use this for complex simulations.

In this video we demonstrate how to setup the simulation in Ansys workbench, but run the simulations in the Autodyn traditional GUI in parallel. A couple of extra tips will help get you going fast.


This video demonstrates how to setup a explosive simulation in Ansys Workbench. Once you complete your 2d simulations, it often becomes important to setup explosive simulations in 3d. In this video we continue our 2d simulation. Setup a 3d simulation then post process in Autodyn.


If you need assistance in creating an explosive model, please feel free to contact us at at info@ozeninc.com or (408) 732-4665.

 

ASME Georgia Southern University Seminar Banner

3D Modeling + Simulation with Ansys

ASME Georgia Southern University Seminar Banner

As a recognized thought leader in the areas of 3D modeling and engineering simulations, our own Dr. Metin Ozen has been asked to speak at an upcoming online event sponsored by Georgia Southern University and ASME.

Feel free to join in on September 7 at 2:00 PM PT and learn from Dr. Ozen’s informative lesson.

Zoom meeting link

 

Crosstalk and Impedance Scan

Crosstalk and Z0 Impedance are important in Signal Integrity. Crosstalk is any unwanted signals in a communication channel (as in a telephone, radio, or computer) caused by transference of energy from another circuit (as by leakage or coupling).

In this video, we studied Crosstalk scan on a PCB by using SIWave. Study is done on both Time domain and Frequency domain. Impedance scan is simulated on the same PCB as well. We used Workflow Wizard, to run the initial checks and verifications.

 

 

SYZ Parameter Using SIWave

Scattering parameters or S-parameters describe the electrical behavior of linear electrical networks when undergoing various steady state stimuli by electrical signals. S-parameters are analytically convenient; they allow for calculations of system performance by cascading the individual components.

In this video, we used SIWave to calculate S and SYZ parameters. Different methods are shown to generate probes on the PCB and measure SYZ parameter. We also illustrated how to run an initial validation on the PCB, how to identify nets, and how to export results in Ansys Electronic Desktop (AEDT).

Webinar Series: Improving Electronic Reliability – Reliability Physics Analysis

 

Ozen Electronic Reliability Webinar Series Banner

The last 30-minute webinar in our Improving Electronics Reliability series focuses on reliability physics analysis.


Improving Electronics Reliability: Reliability Physics Analysis
July 7, 11:00 AM PT

Register here


This webinar will focus on the reliability physics associated with improving electronic reliability.

Goal:

  • PCB reliability
  • Reduce design cycle.
  • Standards compliance: IPC-TR-579, IPC 9704, SAE J3168, MIL, JESD-22 etc.

Solution:

  • Faster Pre-processing: 2D ECAD to 3D MCAD conversion at a click of a button
  • Exhaustive and expandable electronics components, materials and laminates library
  • Complete life curves for Electronics

Benefits:

  • 20-50% time reduction in PCB reliability prediction at Component, Board and System level
  • Optimized component selection and placement for target PCB reliability.
  • Meet regulations at reduced cost for various industry standards by reducing physical prototypes by ~50%