Mechanical Analysis of Solder Balls

Webinar Series: Improving Electronic Reliability – Mechanical Reliability

Ozen Electronic Reliability Webinar Series Banner

The third 30-minute webinar in our Improving Electronic Reliability series focuses on mechanical analysis.


Improving Electronics Reliability: Mechanical Reliability
June 23, 11:00 AM PT

Register here


This webinar will focus on the mechanical aspects of improving electronic reliability.

Goal:

  • Electronics reliability , fatigue and life
  • Standards compliance : IPXX , MIL-STD 810
  • Variability: Material, Manufacturing and assembling

Solution:

  • Detailed traces and vias modeling using reinforcement
  • Nonlinear materials modeling
  • Seamless Workflow: Designers and simulation engineers

Benefits:

  • Trace effects, solder fatigue and assembly stress effects
  • Performance evaluation under environmental conditions and duty cycle
  • Product durability: Shock and drop events
  • Failure due to Moisture ingression
  • Trade off: Cost v/s Reliability

 

Ozen Electronic Reliability Webinar Series Banner

Webinar Series: Improving Electronic Reliability

Ozen Electronic Reliability Webinar Series Banner

Next month, Ozen Engineering will be hosting a series of 30-minute webinars that focus on improving electronics reliability.

Why is it important?

One of the biggest barriers to getting a product to market is unexpected failures during prototype or physical testing. This can result in numerous design cycles, increased costs, delays, and loss of market share.

Businesses that manufacture printed circuit boards (PCBs) can solve these issues by introducing simulation early in the design cycle to determine and predict reliability before physical testing.

Overall, the primary questions to be addressed are:

  • How do I meet urgent market demands faster than my competition AND be confident that my product is reliable?
  • How does simulation save me money and expedite the design cycle?
  • What are the current drivers of electronics reliability?
  • What kinds of analysis and testing can I perform using simulation software?

The first 30-minute webinar is scheduled for June 9 at 11:00 AM PT and will provide an overview of electronic reliability.

Improving Electronic Reliability Overview
June 9, 11:00 AM PT
Register today!!


Future webinars will focus on specific aspects of electronic reliability such as:

  • Thermal
  • Mechanical
  • Electrical stressors

Please plan to join us for one or more of these informative, 30-minute webinars. If you happen to miss a live webinar, we will be making the video recordings available. Just let us know by contacting us at info@ozeninc.com.

 

 

 

Newsletter: Get fast and accurate analysis of rigid and flexible bodies

Read about the latest news from Ozen Engineering and Ansys, Inc.

April 21, 2021

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Ansys Random Vibration (PSD) Analysis

Random Vibration (PSD) Analysis with Ansys Mechanical

The purpose of random vibration analysis is to determine the response of structures to vibration loads that are random in nature. An example would be the response of a sensitive electronic component mounted in a car subjected to the vibration from the engine, pavement roughness, and acoustic pressure.

The frequency content of the time history (spectrum) is captured along with the statistics and used as the load in the random vibration analysis. This spectrum, for historical reasons, is called Power Spectral Density or PSD. In a random vibration analysis, since the input excitations are statistical in nature, so are the output responses such as displacements, stresses, and so on.

Ansys Sherlock - Electronics Reliability Prediction Software

Trace Modeling Reinforcement with Ansys Sherlock

When a thermal or thermal-stress analysis is needed for design of electronics PCB or packaging, it is important to consider the impact of copper traces. Historically, traces have been modeled using Effective Material Properties or Mapped Material Properties (Trace Mapping). The most recent and most accurate technique is Trace Reinforcement Modeling used in both Ansys Sherlock (electronics reliability prediction software) and Ansys Mechanical (finite element analysis) software tools.

The Trace Reinforcement Modeling procedure begins by loading ECAD (e.g. ODB++) into Sherlock, then exporting to an Ansys Workbench project (transfering components, materials, etc). Traces are exported from Sherlock using the .STEP file format and imported to the same Workbench project, where assignments are added for thickness and materials.

Using this simple and straightforward technique we can perform detailed and accurate Structural/Thermal/Dynamic/ Thermal-Stress analysis of the electronics assembly. We can calculate temperature, deformation, and stress distributions for the PCB, components and traces.

Ansys Sherlock - Electronics Reliability Prediction Software Ansys Sherlock - Electronics Reliability Prediction Software
Ansys Sherlock - Electronics Reliability Prediction Software Ansys Sherlock - Electronics Reliability Prediction Software

 

To learn more on how to perform this analysis, please watch this video.