Deduct 100% of the Cost of Your 2018 ANSYS Purchase

Mark Weston

Your company can leverage IRS Section 179 to write off fully 100% of the purchase price of qualifying software purchased before 12/28/18.  All businesses that purchase, finance, and/or lease off-the-shelf software like ANSYS during tax year 2018 should qualify for the Section 179 Deduction of up to one million dollars this year.

This deduction has made a big difference for many companies.  Businesses have used Section 179 to enable them to purchase the software they need right now, instead of waiting.  What ANSYS software would you like this year? Contact us for a quote.

Learn more about Section 179 and calculate your savings through this free Section 179 Deduction Calculator.

Discovery Live Parameter Study

Dr. Ahmed Elghandour


Discovery Live added a new feature that allows the users to run parametric analysis using Design of Experiment (DOE). With the new feature, Parameter Study, the user can select either dimensions or loads as parameters, with different values for each parameter, and run a parametric study for its combination. The user can select any design point to visualize the simulation by one click. The desired results (such as stress and deformation) with the parameters variations can be saved to an external file. Using this useful tool, the users can explore the effect of different variables on the model performance in few minutes and develop more efficient products.

Thermoelectric Simulation with ANSYS

Chris Cowan


ANSYS simulation enables high-resolution modeling of thermoelectric devices.  Through this capability users can determine the resulting temperature distribution, power, coefficient of performance, and more when considering thermoelectric effects.


A brief overview of the thermoelectric phenomena that can be simulated:

  • Joule heating – Heating occurs in a resistive conductor carrying an electric current. Joule heating is proportional to the square of the current and is independent of the current direction.
  • Seebeck effect – A voltage (Seebeck EMF) is produced in a thermoelectric material by a temperature difference. The induced voltage is proportional to the temperature difference. The proportionality coefficient is known as the Seebeck Coefficient (α).
  • Peltier effect – Cooling or heating occurs at a junction of two dissimilar thermoelectric materials when an electric current flows through that junction. Peltier heat is proportional to the current, and changes sign if the current direction is reversed.
  • Thomson effect – Heat is absorbed or released in a non-uniformly heated thermoelectric material when electric current flows through it. Thomson heat is proportional to the current, and changes sign if the current direction is reversed.

ANSYS users have several software options to solve for thermoelectric cooling or generation using Mechanical, AIM, and IcePak.

A Steady-State Thermal-Electric Conduction analysis in ANSYS Mechanical allows for a simultaneous solution of thermal and electric fields. This coupled-field capability models joule heating for resistive materials and contact electric conductance as well as Seebeck, Peltier, and Thomson effects for thermoelectricity.

ANSYS AIM offers a quick and easy platform for designers to solve multiple physics.  AIM features an intuitive graphical user interface and wizard-driven workflow.  AIM includes direct current electric conduction analysis, so that current distribution, power loss and voltage drop of product designs can be determined.  AIM’s many options for multiphysics simulation include fully coupled thermoelectric–stress analysis, which allows power loss to be used as a heat source to compute temperatures — and subsequent thermal deformation and stress — of product designs.

ANSYS IcePak is a vertical application for fluid-thermal analysis of electronics enclosures.  IcePak offers

a custom interface menu to build a thermoelectric module by specifying:  orientation, dimensions, current, and materials (from a library).

If you would like to learn more simulating thermoelectric modules in ANSYS, please contact Ozen Engineering staff to discuss.

Current density in a thermoelectric cooler in AIM

Thermoelectric Cooler Interface in IcePak


Can Ozcan

ANSYS SPEOS is increasing the level of optical simulation based calculation which allows you design your products with optimum optical properties. SPEOS has very compact interface which provides a unique solution for optical design within main CAD design software even for non-optical experts to perform illumination design.

SPEOS is widely use in automotive lighting sector, medical devices, illumination, display backlights, light pipes, automotive lighting, and many other applications. Also, by using SPEOS you will able to simulate interactions of photons with mechanical geometries, to easily design functional illumination background for your end product.

ANSYS R19 HPC Enhancement

Anchong Liu


Throughout the years, ANSYS has dedicated to improve its products in every aspect. Starting R19, ANSYS has made some major enhancement on HPC. Let’s take a look.



Throughout the years, ANSYS has dedicated to improve its products in every aspect. Starting R19, HPC will be able to support PWM source in external circuit, non-constant time-step, and translational motion. If the number of unknowns in your project is greater than 500,000, a GPU can be utilized as well. In the previous version, R19 for example, GPU is used when number of unknowns is greater than 2Million. With the enhancement in the new R19 version, the speed-up is up to 2x or more in comparison with the previous version:


Matrix size CPU time

(8 cores)

CPU time

(8 cores + GPU)


CPU time

(8 cores + GPU)


Speed up
640,000 31s NA 25s 1.2x
1,293,170 2min47s NA 1min57 1.4x
2,260,365 4min4s 3min16 2min34 1.6x

One important aspect of HPC in this new release is that all ANSYS HPCs are consolidated, meaning that ANSYS HPC can be used in lieu of Electronics HPC as well.

Another good news is, ANSYS Mechanical, Fluids and Electronics licenses have 4 built-in HPC tasks enabling to run up to 4 parallel cores without requiring additional HPC licenses.