Newsletter: Improving Thermal and Mechanical Reliability in Electronics

Read about the latest news from Ozen Engineering and Ansys, Inc.

June 9, 2021

Click here to view the PDF

Mechanical Analysis of Solder Balls

Webinar Series: Improving Electronic Reliability – Mechanical Reliability

Ozen Electronic Reliability Webinar Series Banner

The third 30-minute webinar in our Improving Electronic Reliability series focuses on mechanical analysis.


Improving Electronics Reliability: Mechanical Reliability
June 23, 11:00 AM PT

Register here


This webinar will focus on the mechanical aspects of improving electronic reliability.

Goal:

  • Electronics reliability , fatigue and life
  • Standards compliance : IPXX , MIL-STD 810
  • Variability: Material, Manufacturing and assembling

Solution:

  • Detailed traces and vias modeling using reinforcement
  • Nonlinear materials modeling
  • Seamless Workflow: Designers and simulation engineers

Benefits:

  • Trace effects, solder fatigue and assembly stress effects
  • Performance evaluation under environmental conditions and duty cycle
  • Product durability: Shock and drop events
  • Failure due to Moisture ingression
  • Trade off: Cost v/s Reliability

 

Newsletter: Last chance to register – Improving Electronic Reliability

Read about the latest news from Ozen Engineering and Ansys, Inc.

June 2, 2021

Click here to view the PDF

Ozen Electronic Reliability Webinar Series Banner

Webinar Series: Improving Electronic Reliability

Ozen Electronic Reliability Webinar Series Banner

Next month, Ozen Engineering will be hosting a series of 30-minute webinars that focus on improving electronics reliability.

Why is it important?

One of the biggest barriers to getting a product to market is unexpected failures during prototype or physical testing. This can result in numerous design cycles, increased costs, delays, and loss of market share.

Businesses that manufacture printed circuit boards (PCBs) can solve these issues by introducing simulation early in the design cycle to determine and predict reliability before physical testing.

Overall, the primary questions to be addressed are:

  • How do I meet urgent market demands faster than my competition AND be confident that my product is reliable?
  • How does simulation save me money and expedite the design cycle?
  • What are the current drivers of electronics reliability?
  • What kinds of analysis and testing can I perform using simulation software?

The first 30-minute webinar is scheduled for June 9 at 11:00 AM PT and will provide an overview of electronic reliability.

Improving Electronic Reliability Overview
June 9, 11:00 AM PT
Register today!!


Future webinars will focus on specific aspects of electronic reliability such as:

  • Thermal
  • Mechanical
  • Electrical stressors

Please plan to join us for one or more of these informative, 30-minute webinars. If you happen to miss a live webinar, we will be making the video recordings available. Just let us know by contacting us at info@ozeninc.com.

 

 

 

Tire Pressure Monitoring System (TPMS) Antenna Simulation and Calculating Link Budget

Tire Pressure Monitoring System (TPMS) is one of the important part in each and every car. It notifies the driver when the tire pressure is low to decrease chance of accident while it has some other benefits such as increasing fuel efficiency.

A whip antenna with Helix extension is used to study the TPMS. First antenna is designed, studied, and tuned using HFSS. Next a rim is created, and antenna is added to it. After studying the rim, antenna and tuning them, a box is added to the model to represent a car. Then, tuning is done one more time and the receiver antenna is added.

Coupling between different antennas are studied, results are shown as S parameter, Far Field Pattern and E field values. Results are in reasonable communication range. First two videos below explain more details.  Next, the results are exported from HFSS, used in EMIT and Link Budget is studied using BFSK. Third video below will explain more details about it.