Zuken & ANSYS — Easy Approach to PCB Design

Recently, Ozen Engineering has partnered with Zuken to offer customers a better and comprehensive solution to PCB design. By coupling Zuken CR-8000, a product-centric design platform which enables engineers/designers to have a superior and user-friendly PCB design experience in terms of minimized modeling procedures and powerful built-in PCB design library, with ANSYS Electromagnetic products – Siwave and Icepak, PCB designers are able to enjoy a revolutionized work experience at design level, and to simulate at another. ANSYS Electromagnetic products help designers verify their designs by analyze circuit EMI, power/signal integrity, temperature and heat transfer in IC packages and printed circuit boards. Really, you wouldn’t find a better match than Zuken and Ansys in the PCB field.


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ElectroMechanical Transducer Permittivity in ANSYS Mechanical

EM Transducer is a boundary condition commonly used in the simulations of MEMS devices.  Workbench users can download the Piezo & MEMS ACT module from the ANSYS Customer portal to gain access to EM transduce capabilities.  EM Transducer automatically generates TRANS126 elements in Workbench based on the EMTGEN APDL command.

The EM Transducer object uses permittivity of Air as a default and does not allow users to define their own permittivity.  If a user wants to define a custom permittivity, they can create an APDL command object that updates the 7th real constant of the generated TRANS126 elements.  See the sample code below:



epsr=ARG1                                          ! USED TO DEFINE THE RELATIVE PERMITTIVITY
                                                               ! IN THE DETAILS OF THE COMMAND FILE
fini                                                         ! LEAVE THE SOLUTION PROCESSOR
*get,nelems,elem,,count                   ! nelems = NUMBER OF THESE ELEMENTS
elm=0                                                   ! INITIALIZE ELEMENT NUMBER
*do,i,1,nelems elm=elnext(elm)      ! elm = NEXT HIGHEST ELEMENT NUMBER
*get,rnum,elem,elm,attr,real           ! rnum = REAL CONSTANT ID # ASSIGNED TO ELEMENT elm
*get,r7,rcon,rnum,const,7                 ! r7 = VALUE OF 7th REAL CONSTANT IN REAL CONSTANT SET #rnum
r7_new=epsr*r7                                  ! MODIFIED VALUE TO SUBSTITUTE FOR ORIGINAL VALUE
rmod,rnum,7,r7_new                         ! MODIFY THE 7th REAL OF REAL CONSTANT SET ID #rnum


fini                                                          ! LEAVE PREP7
/solu                                                       ! REENTER THE SOLUTION PROCESSOR

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Watch ANSYS Webinars You Missed and Download Workshop Tutorials

Missed our webinars the first time? Visit our new Webinar Library to catch up!




More in the mood for helpful tutorials? Our Industry Solutions pages have a section just for that, in addition to helpful resources and videos. industrysolutionsworkshops


Find your solution on our industry solutions pages for: Internet of Things (IoT) | Battery Solutions | Medical Devices | Antenna Design | Electric Motors

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Tech Tip – Reverse Engineering Your Deformed Results in ANSYS

kaan-80x80The deformed geometry capability in ANSYS R17 is one of the most powerful and easy to use new features in the latest release of ANSYS. In addition to the new workflows that it enables, you can also easily reverse engineer your deformed results using ANSYS SpaceClaim. In this post I’ll show how to take your deformed geometry to another ANSYS analysis. Then I’ll show how you can use the powerful reverse engineering features in SpaceClaim to make your deformed results into a geometry again.

Deformed Geometry – Analysis to Analysis

Where previously you needed to create named selections and use scripts with intermediate MAPDL and FEModeler systems, now you can just drag and drop connections on the Workbench schematic:


A couple of notes:

  • For dynamic analysis that use the Linear Perturbation method, this happens behind the scenes on the mesh already. No need to apply this for the standard harmonic analysis.
  • If you want to use this parametrically, you will need to apply loads on the downstream analysis with APDL or loads that are compatible with nodal named selections. All other named selections and loads will be lost/unassigned when the deformed geometry is updated.
  • The shape but not any stress states are transferred. If stress states are desired, the INISTATE APDL command will be necessary.

Deformed Geometry – Analysis to Geometry

You are not limited to just sending deformed geometry to another analysis, you can also send it back to a geometry using tools that you probably already have. Here we will work with a metal forming test case, done with ANSYS Autodyn. See this workflow in the video below.


The first step is to right click on the desired geometry result and select Export -> STL


The STL format is a faceted data format, which is not strictly compatible with the types of geometry that ANSYS and most CAD systems expect. You can think of it as a surface mesh of triangles around the geometry. It is not explicitly associated with a volume and if the quality of the STL file is poor, filling the mesh can be problematic. An STL surface mesh simply converted into a volume is a relatively inefficient way to represent geometry for ANSYS. Luckily we can do some reverse engineering in ANSYS SpaceClaim, a tool which you may already have.

Notice that our shell elements from ANSYS are represented as 3D in the exported deformed geometry. The STL file is brought in as a mesh body type. ANSYS SpaceClaim is used extensively in reverse engineering. We can see that we have a few options in the Insert -> Reverse Engineering section of the ribbon interface.


We will be using the Skin Surface tool. This allows us to define surface bounds and control points to create a surface corresponding to a surface mesh region. The initial attempt is fairly imprecise:


What happened here is that the surface mesh fitted to both the top AND bottom sides of the thin body. The primary way to deal with this is to sample smaller, less complex areas of the surface. The Skin surface tool lends itself naturally to this workflow of creating patches of several different surfaces.


See this video for more information on the reverse engineering features can capabilities of SpaceClaim.

Optionally we can also improve the quality of the mesh to better resolve the curvature using the Facets tab, enabled by an add-on license to SpaceClaim. It is used commonly in 3D printing applications and it has tools for working with dirtier meshes than what we will generally export from ANSYS.


Once we have all of the surfaces fitted and created, ideally it will turn into a solid automatically. There will typically be precision issues, though, that keep the surfaces from forming an airtight volume. The Repair -> Solidify section has tools to help with this. After fixing some small gaps we have a solid geometry.


Afterwards it is good practice to check the Deviation of how well the geometry matches the source mesh. We can do this in the Measure -> Deviation tool. Notice how the carefully created top surface patches have better deviation than the quick and dirty bottom surface patches.


Hopefully you’ve found that helpful!

If this was useful to you and you’d like to hear other ways to speed up your simulations contact us or subscribe to our newsletter below:


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ANSYS Hardware Requirements – Updated 2016!

kaan-80x80Wondering what hardware is required to run ANSYS? Check out our updated ANSYS hardware requirements page. Decide on your hardware form factor, learn about HPC in two dimensions and hardware developments on the horizon in this post and create a solid foundation for your ANSYS simulations that you can build on for years.

Form Factors

Form_factorsThe first decision to make in the hardware buying process is to choose a form factor. Every organization is different in its computational resource requirements, number of engineers and existing simulation infrastructure. Workstations are a good starting point for many, and can take you a long way, but are more suited to a single engineer. Multiple engineers may make use of a centralized server but issues of pre and post processing can severely degrade the user experience. Whether to invest in graphical resources for a server or to supplement it with a number of relatively modest workstations is an important distinction to make early on. For even greater computational ability, clusters of machines are more affordable than ever but present their own challenges. These are conversations that we’ve frequently had with our customers and this update to the page is a distillation of our recommendations.

See our ANSYS Hardware Requirements Page to decide which form factor is best for you.

HPC in two dimensions:

HPC_Packs_GraphicDid you know that you can scale your ANSYS simulations in two dimensions? For your parametric simulations you can run the same simulation on multiple cores or you can run the different parametric variations (design points) at the same time. You can also combine the two to really crunch through a design space in great time. In my opinion, not enough customers know about both HPC Packs and HPC Parametric Packs which is why I have created this chart.

Remember to use the Remote Solve Manager service to get the most out of your HPC Parametric Pack! You may not have a single big computer than can handle 32 simultaneous solves but if you add several computers to an RSM queue, the simulations will be distributed among the different computers.

See the HPC section of our updated page.

Looking forward to the future:

The following is not on the updated page since it would go out of date quickly, but I thought I share some upcoming things I thought were exciting:

  • It looks like NVIDIA is doing a major architecture update for their Tesla GPUs. The projected specs seem to suggest at least a doubling of performance from current generation GPU cards. The Tesla P100 is in limited release now and should be generally available early 2017.
  • Intel seems to be bumping up against the physical limits of Moore’s law, delaying its famous tick-tock development cycle in lieu of another tock. The 10nm process shrinkage ‘tick’ will need to wait for ‘Cannonlake’ in 2017. There are even suggestions that two step tick-tock cycle may become a tick-tock-opt cycle, with a third Optimization stage to fill it out.
  • AMD is releasing its anticipated Zen CPUs later this year, which are slated to deliver a 40% performance improvement over current processors.

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