Ozen Engineering Newsletter – September 2016

Message from your Channel Partner 

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metinWelcome to September! September is the month when we see increased amount of activity in terms of training, sales, and consulting; most of us are back from our summer vacations and kids’ schools started already. One can tell business is back to normal with the increased traffic on the roads. A long time ago (during 1999-2000 time frame), when I was complaining about traffic, a very good friend of mine reminded me that “the people driving the cars on the roads are potential clients”. I always remember his words when I get stuck in traffic because I have also seen the eerie side when business went down significantly right after 2002 market crash as well as the 2008 financial crisis.

In our ANSYS business, I would like to mention a few important events coming up this fall. With respect to our cloud business, we now offer “bring your own license” cloud services. This means you can use your current ANSYS licenses on our cloud and pay only for the hardware usage. OzenCloud may come in handy for your needs in cases when you are ready to submit a heavy duty structural, CFD, or electromagnetics run. You can use your own license and submit your job on our powerful cloud computers with virtually unlimited memory and CPUs.

This fall, we are changing our webinar schedule; all our webinars will be on Wednesdays at 11AM and you will be able to watch these sessions online. We will even record them for you so that you can watch them at your convenience. Some of these webinars will be followed by a lunch event; the most immediate one coming up on October 5 where we will serve you “lamb barbeque” if you happen to show up for the webinar in person!

Please mark your calendars for October 13-14. We will be co-hosting the ANSYS Convergence Conference with ANSYS at the Computer History Museum in Mountain View. If you are interested in submitting a presentation, please let me know. We are looking for Multiphysics presentations from our customer base who may want to share some interesting ANSYS applications.

Another exciting news is that we will also start teaching ANSYS classes on the East Coast in September. If your company has offices and engineers on the east coast, they can attend ANSYS classes at our new location in Durham, NC. We have started a collaboration with Mallett Technology, Inc. and we will be using their training facilities. To sign up for any of these classes or to see what is being offered, please visit (www.ozeninc.com/training).

Finally, please note that R17.2 is now available on the customer portal. ANSYS will continue to have one major and two minor releases, like we have seen last year and this year, in the foreseeable future. This is a sign of continued and aggressive investment of ANSYS in developing and keeping ANSYS software products #1. Please feel free to contact me if I can be of help with your FEA & CFD needs. Thank you for your business. Have a great September!

By Metin Ozen


 Message from the VP of Sales

Upcoming ANSYS-Ozen Engineering Technology Conference

October 13th-14th

casey

We are pleased to join ANSYS to support the upcoming 2-day technology conference to be held on October 13th-14th at the Computer History Museum in Mountain View.

Come and join us to learn about ANSYS’ latest technologies and solutions for IoT, wearables, medical devices, MEMS and thermal management etc. The 2nd day is devoted to Electric and Autonomous Vehicles, where you can learn from keynotes and domain experts discussing some of the following:

• electric powertrains
• batteries
• durability
• crash
• composites
• embedded software
• antenna and sensors

In addition, you will have an opportunity at the museum to learn about the history of the computers and the roots of today’s internet and mobile devices. The museum has over 1100 historic artifacts, including some of the very first computers from the 1940s and 1950s.

As Metin mentioned, we will invite our customers to present a technical paper at the conference. Currently, we have two slots open and they will be filled based on first come, first serve basis. If you are interested to present, please send me your abstract ASAP.

We will post the agenda and details on our website soon.

Looking forward to meet you at the conference!

By Casey Heydari

casey.heydari@ozeninc.com
(408)-732-4665


What’s New at Ozen Engineering?

BBQ Lunches!

Are you tired of having the same old pizza at events during work lunches? So is our team at Ozen Engineering! Luckily, we have 2 secret weapons – Chris Cowan and a fancy BBQ grill.

Many of you know Chris and have had the pleasure of working with him over the years for technical support or consulting projects. In addition to his title as VP of Engineering, Chris is Ozen Engineering’s King of the Grill, known for his master chef BBQ skills.

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King of the Grill Chris Cowan preparing our BBQ feast of lamb and sausage.

You may be wondering how you can join in on the festivities. On October 5th at 11 a.m., we will host an in-person seminar (also available online) entitled “Application Focus: Conduction, Convection, Radiation, and Thermal-Stress” taught by Dr. Metin Ozen. For those of you who are able to attend this seminar at our office in Sunnyvale, we will have a BBQ lunch immediately following the session. If you are interested in attending, please register here.

Come join us on October 5th!

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Tech Tip

SpaceClaim Primer – Up and Running in Half an Hour

kaan-80x80

Interested in SpaceClaim but finding it hard to get into? Have half an hour to watch a video? Then this SpaceClaim primer is for you. In this video I go over many of the most important features of SpaceClaim from the perspective of a CAE analyst. Since SpaceClaim has so much power packed in one program, you may not even think to look for many of these features until you get deeper into the software. That’s what makes this video a great jumping off point to show many of the powerful features of the software at a high level to get you up and running.

In this video I go over:

  • The Big 4 Modeling Operations: With these 4 operations you can accomplish most of the functionality of traditional CAD tools. See how they allow this and so much more.
  • Productivity Enhancements: From the cross section view, clip to volume, organizing with layers and power selections you will be able to work with geometry faster and in new ways.
  • CAE Prep: Extracting fluid volumes, shared topology for meshing and parameters the simple way and the powerful way. SpaceClaim has the CAE specific functionality to get your geometry ready for analysis.
  • Reverse Engineering: Whether you’re loading an image directly in the software to use as a reference or using SpaceClaim to automatically extract the curves, the reverse engineering capabilities baked into SpaceClaim are extremely powerful. Using SpaceClaims unique ability to simultaneously work with CAD parts and an STL mesh, a biomedical scan geometry will also be processed.

If learning about all of the above in half an hour seems worthwhile to you check out the video below:

Amazing features of SpaceClaim not covered by the above:

  • Drawings creation
  • Wrapping functionality
  • Beam Extraction
  • Patterns/Mirror/Offset relationships
  • Mechanisms
  • Advanced Surface Manipulation
  • Faceted Data Add-on
  • Photo-realistic Rendering Add-on

If this was useful to you and you’d like to hear other ways to speed up your simulations contact us or subscribe to our newsletter below:

Subscribe to Newsletter

  • This field is for validation purposes and should be left unchanged.

By Kaan Divringi


 Tech Tip

R17.2 HFSS Update: Automatic Touchstone File Export

mehrnoosh

ANSYS provides some new features in HFSS R17.2. Automatic Touchstone File Export is a new feature in HFSS that makes your engineering simulation life much easier and happier :-).
Dynamic Link workflow links the S-parameter solutions from EM simulators like HFSS designs to circuit simulator for linear circuit analysis. For example, in Antenna design, you can export S-parameter from HFSS design into a circuit simulation to match the antenna.
The new feature automatically exports the touchstone files to a user selected directory. You just need to set it in HFSS Design Setting:
  • Launching ANSYS Electronics Desktop 2016.2 HFSS
  • HFSS – Design Setting
    • Export S Parameters tab

Mehrnoosh Image 1 -September 2016 Newsletter

 

The default directory for saving the touchstone files is in same location as results directory.

  • <projectname>. Aedtexport
    • <Designname > folder
      • <solutionname > + time stamp + date stamp folder >
    • Touchstone file name = _< sweepname > + solution data base stamp
    • Also included in same directory is index.csv file.
      • Maps values of parameters to touchstone file names in directory.

Mehrnoosh Image 2 - September Newsletter

By Mehrnoosh Khabiri

Upcoming ANSYS Training & Events 

September & October

academic_logo_medium
Free Webinars:
 
Professional Training:

OzenCloud
 
Scale Up Your ANSYS Workloads

OzenCloud provides dramatic performance improvements to FEA and CFD simulations, leveraging advances HPC technologies from the world’s leading hardware vendors.

Is your compute environment too small to handle your ANSYS workloads? Are you looking for performing additional ANSYS simulations on more and faster computers on demand, in our secure cloud environment?

OzenCloud is a perfect platform for customers who are concerned about surge capacity and compute resources or have a short term project but do not wish to commit to a license purchase. In addition, OzenCloud provides dramatic performance improvements to FEA and CFD simulations, leveraging advances HPC technologies from the world’s leading hardware vendors.

If you need any easy to use, on-demand and scalable simulation environment at affordable prices, contact us today for an OzenCloud trial.


Ozen Engineering, Inc.
Newsletter
1210 E. Arques Ave #207
Sunnyvale, CA 94085
(408) 732-4665

Tech Tip – R17.2 HFSS Update: Automatic Touchstone File Export

 

mehrnoosh

ANSYS provides some new features in HFSS R17.2. Automatic Touchstone File Export is a new feature in HFSS that makes your engineering simulation life much easier and happier :-).

Dynamic Link workflow links the S-parameter solutions from EM simulators like HFSS designs to circuit simulator for linear circuit analysis. For example, in Antenna design, you can export S-parameter from HFSS design into a circuit simulation to match the antenna.

The new feature automatically exports the touchstone files to a user selected directory. You just need to set it in HFSS Design Setting:
  • Launching ANSYS Electronics Desktop 2016.2 HFSS
  • HFSS – Design Setting
    • Export S Parameters tab

Mehrnoosh Image 1 -September 2016 Newsletter

The default directory for saving the touchstone files is in same location as results directory.

  • <projectname>. Aedtexport
    • <Designname > folder
      • <solutionname > + time stamp + date stamp folder >
    • Touchstone file name = _< sweepname > + solution data base stamp
    • Also included in same directory is index.csv file.
      • Maps values of parameters to touchstone file names in directory.

Mehrnoosh Image 2 - September Newsletter

By Mehrnoosh Khabiri

Ozen Engineering Newsletter – August 2016

Message from your Channel Partner 

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metin

ANSYS distributors from all around the world got together at the ANSYS headquarters during mid-July. This is the second year that ANSYS is hosting all these channel partners and it is great to see colleagues and exchange/share information about technology from different parts of the world. We are also presented with new ANSYS technology the details of which I cannot talk about here but I can definitely say, with ANSYS, great things are yet to come! First, R17.2 release which is expected any day now. Then, R18 which will be released at the end of the year. We can expect to see similar release schedules in the years to come. Having one major release a year followed by two minor ones is a sign that there is enormous R&D activity at ANSYS and that ANSYS is the market leader by a huge margin.

I am reminded to remind you that the new Multiphysics package, AIM, is now included with your ANSYS Mechanical Enterprise license as of R17.1 and that Simplorer will be included with R17.2. If you are not familiar with it, please read about Simplorer on our website on this page. With R18, we can also expect inclusion of “topological optimization” at no extra charge! But, with the current (R17.X) releases, there are already a bunch of exciting capabilities like “Non-linear Adaptivity”, “ANSYS proprietary fracture criterion”, additional geomechanics features, HPC enhancements, etc. on the mechanical side. On the CFD side, industry leading physics. On the high frequency electromagnetics side, market leading antenna design, EMI/EMC, signal integrity capabilities are all embedded in HFSS product. Needless to say, I am very excited about current and upcoming releases. ANSYS proved again that it is the industry leader not only in technology but in sales as well. Please let me know how I can be of help with your ANSYS software; I know that we have a solution for the type of engineering simulation need you may have. Have a great August!

By Metin Ozen


 Message from the VP of Sales

Introducing Evan Rago – Ozen Engineering’s New Sales Associate

thumbnail_Evan Rago

caseyWe are pleased to introduce our new sales associate – Evan Rago who just joined us in our Sunnyvale office.

Evan spent the last six month in ANSYS HQ in Canonsburg, PA to attend a rigorous sales and product training before transferring to Sunnyvale.

Evan is a graduate of the Swanson School of Engineering at the University of Pittsburgh where he holds a B.S. in Industrial Engineering and a Green Belt Certification in Six-Sigma.  Evan’s early experiences started out as an Application’s Engineer for a Carnegie Mellon University Start-Up company by the name of Seegrid.  He then moved to Paris, France, where he was a Project Manager for an AGV (automated guided vehicle) company named Balyo.  Shortly after his promotion to Project Manager North American, he decided to follow his passion for sales.  Now, Evan is part of the Ozen Engineering sales team. When he is not helping potential customers realize the cost savings of implementing a simulation driven product development, you can find him inside cooking, or outside hiking, skiing, or fishing.

Please join me in welcoming Evan to our sales team!

casey.heydari@ozeninc.com

(408) 732-4665

By Casey Heydari


What’s New at Ozen Engineering?

Our Online Training Program

Are you dying to attend an Ozen Engineering training but just can’t get away from your desk?  Don’t worry!  Ozen Engineering now offers two new online options:

1) On Demand Training:

  • Receive links to recorded video lectures
  • Complete a knowledge test quiz after each section/at the end to show completion
  • 1 hour Gotomeeting session for questions and additional topics
  • Completely self-paced
2) Live Virtual Classroom:
  • Sessions – 2-hour Gotomeeting sessions on consecutive business days minus Friday (Number of sessions is to be determined based on the course)
  • Immediate feedback & workshop help
  • Flexible schedule
Are you interested in signing up? Contact us today at (408) 732-4665 or info@ozeninc.com.

 Tech Tip

Designing Next Big Things in IoT – ANSYS Chip Package System (CPS)

mehrnoosh

The rapid development of smart devices brings some engineering challenges, most particularly the increase in complexity of the products and their operating environment. Engineers must consider and include the comprehensive characteristic of the product and system in their design. The ANSYS Chip Package System (CPS) flow enables engineers to predict real-world performance of their products through simulation. ANSYS CPS addresses design challenges in Signal Integrity (SI), Power Integrity (PI), Electrostatic Discharge (ESD), Antenna Performance, Thermal and Structural challenges.

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Smart Watch Design-Performing SI/PI, Thermal/Structural Integrity, and Antenna Performance

Power Efficacy

Low power design is an important fact in smart devices. It requires small voltage margins, fast transitions between power states, and low swing communication between components. SI/PI simulations consider all interactions between chip, package and board in a design. Analyzing the SI of a system requires co-simulation of IO ring, package, PCB decoupling and channel to ensure a system will meet its timing and performance target. PI analysis is required for optimizing the power delivery network (PDN) and implementation of low power design features with co-simulation of the chip, package, and PCB.

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Signal and Power Integrity Analysis

Chip Modeling for system-level

ANSYS Integrated Circuit (IC) solution software like RedHawk and Totem validate low power design at the chip-level and also generate a Chip Power Model (CPM) for system-level PI and Electromagnetic Interference (EMI) analysis. ANSYS SIwave imports a CPM to drive a chip-package-board co-simulation. SIWave can be used to optimize component placement and decoupling capacitor solutions to achieve the best product performance and cost targets. Also in ANSYS 17.X, SIwave now have direct access to thermal simulation data and can map these effects to their electrical analysis.

Thermal/Structural Performance

Thermal/structural performance is another challenge in the product design consideration for packages and PCBs. Thermal impact on the package, especially from the IC, is a key driver for material selection, cooling, and form factor decisions, which ultimately determine the size, weight and cost of the final product. Therefore it is critical for design engineers to accurately model the thermal signature of their system and the thermal stress on the structural integrity of their product. ANSYS CPS flows use the same electrical layout database in thermal and mechanical analysis, so design engineers can easily map thermal to structural analysis to highlight deformation, strain and stress issues on the package.

Design Engineers must overcome these challenges and no other technology can help engineers, more than ANSYS Engineering Simulation. For more information, please visit our website – industry solution: http://www.ozeninc.com/industry-solutions/

By Mehrnoosh Khabiri


Tech Tip

Transient Animation Improvements in CFD-Post 

CFD-Post Animation graphical user interface

CFD-Post Animation graphical user interface

Chris Cowan ImageANSYS CFD-Post is a state-of-the-art postprocessing tool used to visualize and quantify results from CFD simulations. At R17, transient flow variations are easier to animate using the new “Timestep Animation” option. This new capability uses ‘music-player’ style controls to play back transient results.
Some new user-interface options for Timestep Animation:
  • ‘Specify Range For Animation’ allows to trim the start/stop at specific timesteps instead of playing the entire animation.
  • ‘Advanced Frame Selection Controls’ allows to skip timesteps during the animation. This option is useful for speeding-up creation of animations from large results files.
By Chris Cowan
kaan-80x80
The deformed geometry capability in ANSYS R17 is one of the most powerful and easy to use new features in the latest release of ANSYS. In addition to the new workflows that it enables, you can also easily reverse engineer your deformed results using ANSYS SpaceClaim. In this post I’ll show how to take your deformed geometry to another ANSYS analysis. Then I’ll show how you can use the powerful reverse engineering features in SpaceClaim to make your deformed results into a geometry again.

Deformed Geometry – Analysis to Analysis

Where previously you needed to create named selections and use scripts with intermediate MAPDL and FEModeler systems, now you can just drag and drop connections on the Workbench schematic:

DeformedGeometryAnalysisToAnalysis

A couple of notes:

  • For dynamic analysis that use the Linear Perturbation method, this happens behind the scenes on the mesh already. No need to apply this for the standard harmonic analysis.
  • If you want to use this parametrically, you will need to apply loads on the downstream analysis with APDL or loads that are compatible with nodal named selections. All other named selections and loads will be lost/unassigned when the deformed geometry is updated.
  • The shape but not any stress states are transferred. If stress states are desired, the INISTATE APDL command will be necessary.

Deformed Geometry – Analysis to Geometry

You are not limited to just sending deformed geometry to another analysis, you can also send it back to a geometry using tools that you probably already have. Here we will work with a metal forming test case, done with ANSYS Autodyn. See this workflow in the video below.

The first step is to right click on the desired geometry result and select Export -> STL

DeformedGeomContextMenu

The STL format is a faceted data format, which is not strictly compatible with the types of geometry that ANSYS and most CAD systems expect. You can think of it as a surface mesh of triangles around the geometry. It is not explicitly associated with a volume and if the quality of the STL file is poor, filling the mesh can be problematic. An STL surface mesh simply converted into a volume is a relatively inefficient way to represent geometry for ANSYS. Luckily we can do some reverse engineering in ANSYS SpaceClaim, a tool which you may already have.

Notice that our shell elements from ANSYS are represented as 3D in the exported deformed geometry. The STL file is brought in as a mesh body type. ANSYS SpaceClaim is used extensively in reverse engineering. We can see that we have a few options in the Insert -> Reverse Engineering section of the ribbon interface.

SCDMReverseEngineeringRibbon

We will be using the Skin Surface tool. This allows us to define surface bounds and control points to create a surface corresponding to a surface mesh region. The initial attempt is fairly imprecise:

SkinSurfaceFirst

What happened here is that the surface mesh fitted to both the top AND bottom sides of the thin body. The primary way to deal with this is to sample smaller, less complex areas of the surface. The Skin surface tool lends itself naturally to this workflow of creating patches of several different surfaces.

SkinSurfaceNext

See this video for more information on the reverse engineering features can capabilities of SpaceClaim.

Optionally we can also improve the quality of the mesh to better resolve the curvature using the Facets tab, enabled by an add-on license to SpaceClaim. It is used commonly in 3D printing applications and it has tools for working with dirtier meshes than what we will generally export from ANSYS.

FacestSmoothing

Once we have all of the surfaces fitted and created, ideally it will turn into a solid automatically. There will typically be precision issues, though, that keep the surfaces from forming an airtight volume. The Repair -> Solidify section has tools to help with this. After fixing some small gaps we have a solid geometry.

SolidifyRibbonAndSolid

Afterwards it is good practice to check the Deviation of how well the geometry matches the source mesh. We can do this in the Measure -> Deviation tool. Notice how the carefully created top surface patches have better deviation than the quick and dirty bottom surface patches.

DeviationResult

Hopefully you’ve found that helpful!

By Kaan Divringi


Upcoming ANSYS Training & Events 

August & September

academic_logo_mediumProfessional Training:

OzenCloud
 
Scale Up Your ANSYS Workloads

OzenCloud provides dramatic performance improvements to FEA and CFD simulations, leveraging advances HPC technologies from the world’s leading hardware vendors.

Is your compute environment too small to handle your ANSYS workloads? Are you looking for performing additional ANSYS simulations on more and faster computers on demand, in our secure cloud environment?

OzenCloud is a perfect platform for customers who are concerned about surge capacity and compute resources or have a short term project but do not wish to commit to a license purchase. In addition, OzenCloud provides dramatic performance improvements to FEA and CFD simulations, leveraging advances HPC technologies from the world’s leading hardware vendors.

If you need any easy to use, on-demand and scalable simulation environment at affordable prices, contact us today for an OzenCloud trial.


Ozen Engineering, Inc.
Newsletter
1210 E. Arques Ave #207
Sunnyvale, CA 94085
(408) 732-4665

Ozen Engineering Newsletter – July 2016

Message from your Channel Partner 

17.1-Image

metinWelcome to July! This is the time of the year when many co-workers go on vacation. If you are on vacation, have a great time and enjoy it!

The month of June was busy with technology as well as sports: Copa America soccer matches here as well as UEFA Euro soccer games in France. In the meantime, ANSYS has put together a nice series of webinars that talks about how simulations help the sports industry; from kayaks to soccer ball aerodynamics to bicycle racing. You can see that past and future webinars here.

In the month of June, there were a couple of important presentations that we were involved in; the first one was on “IoT: Modeling Sensors and MEMS with ANSYS”. This presentation talked about IoT and how MEMS fits in the IoT frame as well as examples of ANSYS simulations for MEMS applications. The second presentation was NextFlex workshop on “Flexible Hybrid Electronics (FHE) Modeling & Design Tools”. This workshop was about adapting today’s computer aided design tools for electrical, mechanical, thermal, and other simulation of FHE devices/materials.

So, have a happy 4th of July weekend and please let me know how I can be of help with ANSYS software tools and simulations. Have a great July!

By Metin Ozen

 Message from the Sales Manager

AIM Image

ANSYS AIM Promotion – A Dream Come True for Designers and Engineers

caseyAs we are getting closer to the end of Q2, some of our promotions will end on June 30th. However, the good news is that we have introduced an attractive promotional campaign for ANSYS AIM, which will last through September 30th , 2016.

Over the next few months, we will sponsor three free webinars about ANSYS AIM to educate designers and engineers as to how ANSYS AIM can be used for multi-disciplinary simulation and product design. For an introduction to ANSYS AIM, watch this video:

ANSYS AIM is a simulation environment designed to make it easy for engineers to reap the benefits of single physics and multiphysics simulations when designing their products. Automated, intuitive workflows allow you to skip the steep learning curve and start using simulation early in your design process, when the cost of making changes is minimal. Every engineer in your organization, including recent college graduates and less experienced product engineers, should be using simulation to get your products to market faster and more cost-effectively. ANSYS AIM can make this happen.

 Here are three things you can do to participate in this special offer:
  • Register for three free webinars about ANSYS AIM so you can see yourself what it can do
  • See if you qualify for a 21-day free trial license of AIM with full support from ANSYS experts
  • Take advantage of special pricing on AIM licenses through September 30, 2016
Don’t miss out on this opportunity! Contact us today.

casey.heydari@ozeninc.com
(408) 732-4665

By Casey Heydari

Tech Tip

New Multiphysics Coupling for Electric Machine Design in ANSYS R17.1

mehrnooshANSYS offers a comprehensive Multiphysics Design for Electric Machines.  ANSYS’ electric machine design flow provides a complete virtual prototyping laboratory for machine design and development. The Electrical Machine Design Methodology includes machine design, finite element analysis, system analysis, optimization, thermal, stress and acoustical analysis. In ANSYS 17.1, a new Multiphysics coupling for Electric Machine Design is added. Automatic link generation from Maxwell-RMxprt to Icepak is a new multiphysics capability which provides:

– Geometry generation

– Mesh control definition

– Boundary and excitation definition

– Creating CFD transient settings

RMxprt solved models can be exported as an Icepak design. To create an Icepak design:

  • Click RMxprt > Analysis Setup > Create Icepak Design; or right-click on the analysis setup in the Project tree and select Create Icepak Design from the context menu.

GetAttachmentThumbnail

For more information about Electric Machine designs, please visit our website- industry solution section- for Electric Motors.

By Mehrnoosh Khabiri


kaan-80x80
Wondering what hardware is required to run ANSYS? Check out our updated ANSYS hardware requirements page. Decide on your hardware form factor, learn about HPC in two dimensions and hardware developments on the horizon in this post and create a solid foundation for your ANSYS simulations that you can build on for years.   

Form Factors

Form_factorsThe first decision to make in the hardware buying process is to choose a form factor. Every organization is different in its computational resource requirements, number of engineers and existing simulation infrastructure. Workstations are a good starting point for many, and can take you a long way, but are more suited to a single engineer. Multiple engineers may make use of a centralized server but issues of pre and post processing can severely degrade the user experience. Whether to invest in graphical resources for a server or to supplement it with a number of relatively modest workstations is an important distinction to make early on. For even greater computational ability, clusters of machines are more affordable than ever but present their own challenges. These are conversations that we’ve frequently had with our customers and this update to the page is a distillation of our recommendations.

See our ANSYS Hardware Requirements Page to decide which form factor is best for you.

HPC in two dimensions:

HPC_Packs_GraphicDid you know that you can scale your ANSYS simulations in two dimensions? For your parametric simulations you can run the same simulation on multiple cores or you can run the different parametric variations (design points) at the same time. You can also combine the two to really crunch through a design space in great time. In my opinion, not enough customers know about both HPC Packs and HPC Parametric Packs which is why I have created this chart.

Remember to use the Remote Solve Manager service to get the most out of your HPC Parametric Pack! You may not have a single big computer than can handle 32 simultaneous solves but if you add several computers to an RSM queue, the simulations will be distributed among the different computers.

See the HPC section of our updated page.

Looking forward to the future:

The following is not on the updated page since it would go out of date quickly, but I thought I share some upcoming things I thought were exciting:

  • It looks like NVIDIA is doing a major architecture update for their Tesla GPUs. The projected specs seem to suggest at least a doubling of performance from current generation GPU cards. The Tesla P100 is in limited release now and should be generally available early 2017.
  • Intel seems to be bumping up against the physical limits of Moore’s law, delaying its famous tick-tock development cycle in lieu of another tock. The 10nm process shrinkage ‘tick’ will need to wait for ‘Cannonlake’ in 2017. There are even suggestions that two step tick-tock cycle may become a tick-tock-opt cycle, with a third Optimization stage to fill it out.
  • AMD is releasing its anticipated Zen CPUs later this year, which are slated to deliver a 40% performance improvement over current processors.

Keep up to date on hardware and ANSYS simulation news and tips by subscribing to our newsletter:

Subscribe to Newsletter

  • This field is for validation purposes and should be left unchanged.

By Kaan Divringi


Upcoming ANSYS Training & Events 

July & August

academic_logo_mediumProfessional Training:

OzenCloud
 
Scale Up Your ANSYS Workloads

OzenCloud provides dramatic performance improvements to FEA and CFD simulations, leveraging advances HPC technologies from the world’s leading hardware vendors.

Is your compute environment too small to handle your ANSYS workloads? Are you looking for performing additional ANSYS simulations on more and faster computers on demand, in our secure cloud environment?

OzenCloud is a perfect platform for customers who are concerned about surge capacity and compute resources or have a short term project but do not wish to commit to a license purchase. In addition, OzenCloud provides dramatic performance improvements to FEA and CFD simulations, leveraging advances HPC technologies from the world’s leading hardware vendors.

If you need any easy to use, on-demand and scalable simulation environment at affordable prices, contact us today for an OzenCloud trial.


Ozen Engineering, Inc.
Newsletter
1210 E. Arques Ave #207
Sunnyvale, CA 94085
(408) 732-4665

Ozen Engineering Newsletter – June 2016

Message from your Channel Partner 

17.1-Image

metinMay is already gone! I think May 2016 was one of the fastest Mays ever in our history :-). We have had classes, Lunch & Learns, and technical certifications, and more. For the month of June, we have scheduled 4 (four) Lunch & Learns and multiple training classes. We are anticipating more engineers getting trained for different physics. We have noticed a significant increase of interest in electric motor design and simulations where ANSYS/Maxwell is the perfect tool. In addition, with the Internet of Things (IoT), we have also observed an increased interest in high frequency antenna design, thermal issues, thermal-stress, and structural drop/shock simulations of the IoT designs. We also started working with R17.1 and we like it! You should also check out the new ANSYS product, AIM, which comes at no additional cost if you already have an ANSYS/Mechanical Enterprise license. AIM enables Multiphysics capabilities in an easy-to-use environment. Please let me know if/how I can be of assistance with ANSYS software tools. Have a great June!

By Metin Ozen

 Message from the Sales Manager

Get Ready! The Next Industrial Revolution is Here!

The IoT Revolution and the 7 Applications that are Changing the World!

caseyThe Internet of Things (IoT) has been called the next Industrial Revolution — it will change the way all businesses, governments, and consumers interact with the physical world.

According to Gartner estimates, the world will see 25-30 billion connected devices by 2025, representing a market opportunity approaching $11 trillion.

While innovations in factory automation, smart cities, consumer electronics and healthcare stand out, virtually no aspect of the global econo¬my will be left untouched by the “collect-connect-correlate” value of the IoT.

ANSYS and Ozen Engineering, Inc. are proud to be a technology contributor in IoT revolution by providing solutions in 7 key applications areas that are changing the world. These are:

1.    Antenna design and placement for reliable and high fidelity communication.
2.    CPS (Chip Package System) design
3.    Power Management
4.    Sensors ad MEMS design
5.    Embedded Software
6.    Design for harsh environments
7.    Virtual System Prototyping

To learn more details about these 7 Key Applications, I’d invite you to sign up for our complimentary Lunch & Learns and see how ANSYS technologies can help you with your innovations and product designs. Don’t miss “Antenna Design for IoT Applications” on June 9th followed by “Electronics Thermal Management” on June 16th

Introducing ANSYS HFSS SBR+ – Best of Both Worlds!

Solve Large-Scale problems in a Connected World with HFSS SBR+

Discover how the Shooting and Bouncing Rays (SBR) technique implemented in Savant enables fast and accurate simulation of very large antenna problems, and how antenna designs created in HFSS can easily be imported into Savant, placed on an electrically large platform.

casey.heydari@ozeninc.com
(408)-732-4665

By Casey Heydari

What’s New at Ozen Engineering? 

Ozen Engineering Takes Home 2 Awards!

Industry Honors Dinner

We are pleased to announce that Ozen Engineering, Inc. received 2 awards from the ASME Santa Clara Valley Section. Allyson Clark, ASME Santa Clara Valley Section Chair, presented the awards to Dr. Ozen during the Industry Honors Dinner event on May 5, 2016.

 Meet Furkan Ozedirne – Ozen’s Summer Intern  

Furkan Ozerdine Headshot

We are happy to introduce Furkan Ozedirne, our new Intern at Ozen Engineering! Furkan is an undergraduate student at the University of California, Merced pursuing a B.S. in Mechanical Engineering. He is excited to begin his third year in Fall 2016 and see what new material his classes have to offer.

Furkan not only focuses on academics, but extracurriculars as well. He is the Co-Founder and Vice-President of Society of Automotive Engineers. With his team, Bobcat Racing EV, they are in the design phase to compete in the Formula SAE Electric race, held by SAE International. Furkan also conducts undergraduate research at the Mechatronics, Embedded Systems, and Automation (Mesa) Lab. Here, he builds circuits and codes for Arduino, and aids in drone research. While interning, Furkan hopes to learn about working in an office environment and more about ANSYS simulations. In his free time, Furkan enjoys taking advantage of Yosemite National Park being close to the campus and spending time with friends. Furkan is excited to join the team at Ozen Engineering and working with you!

Please contact Furkan (Furkan.Ozedirne@ozeninc.com) with any questions.
By Maryam Nemazie

Tech Tip

 What is the role of Engineering Simulations in the Internet of Things (IoT)?

mehrnooshBy 2020, there will be 26 smart devices for every human being on Earth according to one estimate.  IoT will result in an explosion of products with integrated antennas and sensors and world is more connected than ever in IoT age. However, IoT brings some Engineering challenges, most particularly the increase in complexity of the products and their operating environment.

Engineering challenges for IoT are developing and managing Things, Network and Data/Cloud. Engineers must consider and include the comprehensive characteristic of environment in their designs. Well, engineering simulation is the golden key and ANSYS simulation technologies are speeding the development of three IoT elements: IoT devices, networking infrastructure and cloud computing platforms. Engineers need to create virtual prototypes and simulate them to make sure they will work in the real world. Common design challenges for IoT are Structural and Thermal Reliability, Power Management, Communication Efficiency, Privacy and Security, Multiple Standards, Quality of Service, Energy Efficiency, and Miniaturization.

Design Engineers must overcome these challenges and no other technology can help engineers, more than engineering simulation. ANSYS offers a comprehensive solution for IoT industry challenges with simulation tools for electronics, semiconductors, embedded software, mechanical structures, fluids, and heat flow.

Visit our IoT webpage for more information and learn more about how we can help you to design your IoT Products.

3elementsIoT

The interaction of the three elements of the Internet of Things

By Mehrnoosh Khabiri


kaan-80x80
Want to speed up your ANSYS Mechanical simulations? We all know how we can use hardware , software and the cloud to decrease computation time but how about reducing your engineering time by getting familiar with keyboard shortcuts? In the last few versions, keyboard shortcuts have been added to Mechanical but they can be buried in the documentation or a tool-tip will remind you after you’ve already used it. That’s why I’ve collected them all in one place in a convenient cheat sheet:

AnsysMech_KeyboardCheatsheet_thumb

Download Cheatsheet (PDF)

There may be some shortcuts that you didn’t know about here:

Select Mode: Switching from box select to single select and vice versa can be one of the biggest headaches due to the dropdown menu involved. In the graphics window hold down the right mouse button and then click the left, making sure not to move your mouse at all. You should notice the cursor change the select mode. If you’re doing many such operations, this can be a lifesaver.

Triad Shortcuts: There are many view shortcuts that let you access the functionality of the triad from the keyboard too. You can access the same functionality as clicking the axes with your number pad (keys 1-3 and 7-9). These include both the positive and negative direction. You can also go to an isometric view with the 0 key or set it to the nearest isometric view with the dot(.) key.

Selection Filters:  By holding Ctrl and selecting one of P/E/F/B you can switch between geometry selection filters easily. If you switch to the new node or element selection filters (N/M), the lasso select mode will become available to you.

Download it, print it out and tape it up near your monitor to speed up your analysis today!

If this was useful to you and you’d like to hear other ways to speed up your simulations contact us or subscribe to our newsletter below:

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By Kaan Divringi


Lunch & Learn

Antenna Design for IoT Applications

June 9, 2016
11:30AM – 1:00PM (lunch provided)
Upon completion of this event, attendees are eligible to receive a
14-day evaluation license.

Join us for this upcoming lunch & learn event featuring Antenna Design for IoT Applications!

You learn how to design the antenna and improve integrated antenna performance early in the design cycle within an IoT product. Antennas often designed in isolated or ideal conditions. But antenna performance can be very different when mounted on realistic and complex platforms. In this Lunch & Learn, Antenna design methodology, antenna placement and coupling will be introduced using ANSYS HFSS and ANSYS HFSS-SBR (Savant).

Lunch & Learn

Electronics Thermal Management

June 16, 2016
11:30AM – 1:00PM (lunch provided)
Upon completion of this event, attendees are eligible to receive a

14-day evaluation license.

Join us for this upcoming lunch & learn event featuring Electronics Thermal Management!
Thermal management and thermal stress are two very important parts of analysis for electronics products but are often parallel, unrelated processes. Ansys R17 offers new functionality for more fully resolving the ECAD detail in a thermal stress analysis. In this seminar see how the Ansys Workbench platform allows quick and easy transfer of Ansys Icepak thermal conditions into a Ansys Mechanical structural analysis, allowing a fully detailed thermal stress analysis.

Lunch & Learn

Fracture Mechanics & Fatigue 

June 23, 2016
11:30AM – 1:00PM (lunch provided)
Upon completion of this event, attendees are eligible to receive a
14-day evaluation license.

Join us for this upcoming lunch & learn event featuring Fracture Mechanics & Fatigue!

This session is for engineers wishing to use ANSYS Mechanical to analyze the crack initiation and crack propagation behavior. This event covers information on the Fracture Mechanics theory as well as numerical modeling. It will also review the fundamentals of fracture mechanics; history, derivation of mathematical expressions for stress intensity factors; 2D versus 3D, crack tip stress field, three modes of fracture, maximum principal stress criterion, crack initiation and crack propagation, strain energy density theorem, J-Integral, mixed mode cracking, XFEM method, cohesive zone modeling, implementation of crack modeling in ANSYS Workbench, and fatigue crack growth.

Lunch & Learn

Overview of ANSYS CFD

June 30, 2016
11:30AM – 1:00PM (lunch provided)
Upon completion of this event, attendees are eligible to receive a
14-day evaluation license.

Join us for this upcoming lunch & learn event featuring an Overview of ANSYS CFD.

This event introduces the practicing engineer to computation fluid dynamics simulation with ANSYS Fluent. As the leading CFD software, ANSYS Fluent provides diverse and powerful capabilities for CFD applications. This session includes an introduction to CFD simulation and moves on setting up and solving turbulent flow and heat transfer problems.

Upcoming ANSYS Training & Events 

In June & July

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Free Lunch & Learns:

OzenCloud
 
Scale Up Your ANSYS Workloads

OzenCloud provides dramatic performance improvements to FEA and CFD simulations, leveraging advances HPC technologies from the world’s leading hardware vendors.

Is your compute environment too small to handle your ANSYS workloads? Are you looking for performing additional ANSYS simulations on more and faster computers on demand, in our secure cloud environment?

OzenCloud is a perfect platform for customers who are concerned about surge capacity and compute resources or have a short term project but do not wish to commit to a license purchase. In addition, OzenCloud provides dramatic performance improvements to FEA and CFD simulations, leveraging advances HPC technologies from the world’s leading hardware vendors.

If you need any easy to use, on-demand and scalable simulation environment at affordable prices, contact us today for an OzenCloud trial.


Ozen Engineering, Inc.
Newsletter
1210 E. Arques Ave #207
Sunnyvale, CA 94085
(408) 732-4665