• Finite Element Analysis (FEA)

  • Computational Fluid Dynamics (CFD)

  • Electromagnetics

  • Industry Specific Applications

Ansys Engineering Simulation Consulting

Ozen Engineering is located in the heart of Silicon Valley and serves a variety of technology companies and industries. Over the past 25 years, we have spent the majority of our waking hours serving our customers need for high fidelity simulation.

We pride ourselves on our accuracy, deep experience, responsive customer service, and dependable delivery. With decades of experience under our belt we are the Finite Element Analysis (FEA), Computational Fluid Dynamics (CFD), Electromagnetics (FEM) and ANSYS tools consultants of choice. Please contact us to request a quotation for consulting services.  An engineer will contact you to discuss your project or schedule a time to meet with your team.

Please click on the following areas of our expertise for more details:

Our Quoting Process

Meet with our engineers to define the business and technical needs of your simulation project in a Statement of Work (SoW). With a SoW and all relevant geometries we will give a fixed price quote for your project. We do not charge for computation time, only engineering time. An ongoing hourly rate is also available.

Technology Transfer

Are you interested in raising the level of simulation in your organization but need help in kick-starting the process? A consulting project with OEI is the best way to take your organizational simulation capabilities to the next level. Our experts will not only solve your hardest problem but transfer simulation files and offer application specific training. There is no better way to supercharge an organization’s technical capabilities.

Startups Innovate with Ozen

In the very early stages of a startup but need the simulation capabilities of the most advanced tool on the market? Ozen Engineering can work out a deal with startup companies to make sure they get the most innovation possible in the crucial early stages.


Our world class technical support engineers are available to help you get up to speed in the top of the line simulation tools. Our software customers already have this benefit but due to outside demand have begun to offer it separately as a product.

Please contact us to request a quotation for FEA & CFD consulting services. An engineer will discuss your project or schedule a time to meet with your team.
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We take pride in serving our Silicon Valley and International customers in the following disciplines:


  • Acoustics
  • Chemical Reactions
  • Circuit & System
  • Computational Fluid Dynamics
  • Dynamics/Rotating Machines
  • Electric
  • Electromagnetic Interference (EMI)
  • Electromagnetic low-frequency & high-frequency
  • Electromechanical
  • Explicit Dynamics
  • Fluid-Structure Interaction (FSI)
  • Hydrodynamics
  • Multibody Dynamics
  • Near and Far Field Radiation
  • Optics & Lighting
  • Power Integrity (PI)
  • Process Simulation
  • Signal Integrity (SI)
  • Structural
  • Thermal
  • Turbulence Modeling (LES, DES, SBES)


  • Chip-Package-System Analysis
  • 5G
  • Additive Manufacturing & 3D Printing
  • Antenna Design
  • Autonomous Vehicles
  • Battery Crush
  • Battery Thermal Runaway
  • Bioreactor/Mixing Simulation
  • Cloud Compute
  • Combustion
  • Cycling Reliability & Fatigue
  • Digital Twin
  • Electric Machines
  • Electric motor
  • Electrification
  • Electronics Thermal Management & Heat Transfer
  • Embedded Systems
  • Extrusion & Thermoforming
  • Fatigue & Reliability
  • Flow Uniformity
  • High Performance Computing
  • Icing
  • Industrial Internet of Things (IIoT)
  • Integrated Circuits (ICs)
  • Magnet Design
  • Meshing
  • Multi-Objective Optimization
  • Noise, Vibration, Harshness (NVH)
  • Parametric Design Optimization
  • Patient Specific Analysis
  • Predictive Maintenance
  • Process Conditions
  • Random Vibration
  • Reduced Order Modeling (ROM)
  • RF & mmWave Filter Design
  • RF, Microwave Circuits
  • Scattering Problems
  • Semiconductor Chambers
  • Shape Memory Alloys
  • Package Thermal Resistance
  • Tire Modeling
  • Wireless Charging


  • Aerospace
  • Automotive
  • Battery
  • Biotechnology
  • Computer Hardware
  • Construction
  • Consumer Goods
  • Electric Car
  • Electronics
  • Energy
  • Healthcare
  • High-Tech
  • Industrial Equipment
  • Internet of Things (IoT)
  • Materials & Chemical Processing
  • Medical Devices/Healthcare
  • MEMS
  • Military
  • Renewable Energy
  • Rotating Machinery
  • Semiconductor
  • Sensor Design
  • Telecommunication
  • UAVs and Drones
  • Wireless Communication

Testing Standards

  • 3GPP, Release 15, 5G System
  • ANSI/IEC, 60529-2004, Protection Provided by Enclosures
  • ASTM, ASTM F2514-08; 2014: Standard Guide for Finite Element Analysis (FEA) of Metallic Vascular Stents Subjected to Uniform Radial Loading
  • ASTM, ASTM-F2415, FEA of Metallic Stents
  • Automotive Electronics Council, AEC-Q100 (and Q101, Q104, Q200), Failure Mechanism Based Stress Test Qualification For Integrated Circuits, Discrete Semiconductors, Multichip Modules, Passive Components
  • DNV, DNVGL-RP-C208, Determination of structural capacity by non-linear finite element analysis methods
  • FMVSS103, Windshield Defrosting and Defogging Systems
  • IEEE, IEEE 802.11, Wi-Fi network
  • IPC, IP67, Protection of electronics enclosure against dust, water, intrusion
  • IPC, IPC/JEDEC 9702, Bending, Monotonic and Cyclic (BLRT)
  • IPC, IPC-9701, Temperature Cycling (BLRT)
  • IPC, IPC-9701, Temperature Cycling (BLRT)
  • IPC, IPC-9703, Mechanical Shock
  • IPC, IPC-9707, Spherical Bend
  • ISO, ISO 16750, Environmental conditions and electrical testing for electrical and electronic equipment
  • ISO, ISO 16750-4, Start-Up and Temperature Steps (BLRT)
  • JEDEC, JEP150, Stress-Test Driven Qualification of Assembled Solid-State Surface Mount Components
  • JEDEC, JESD22A104, Condition J, Temperature Cycling (BLRT)
  • JEDEC, JESD22A105, Power Temperature Cycling (BLRT)
  • JEDEC, JESD22A113, Assembly to the board for Board Level Reliability Testing (BLRT)
  • JEDEC, JESD22A119, Low-Temperature Storage Life (BLRT)
  • JEDEC, JESD22B103, Condition 1, Vibration, Harmonic (BLRT)
  • JEDEC, JESD22B110, Condition A, Drop Testing (BLRT)
  • JEDEC, JESD22-B111, Drop test for electronics components
  • JEDEC, JESD22B113, Cyclic Bend
  • JEDEC, JESD51-14, Measuring the junction-to-case thermal resistance. It is relatively newcomer; it concerns only packages having a single heat flow and an exposed cooling surface
  • JEDEC, JESD51-2 (and JESD51-6, JESD51-8, JESD51-14), Thermal resistance of electronics packages
  • Military, MIL-STD 461G, Electromagnetic Interference with Lightning
  • Military, MIL-STD-769, Thermal Insulation Requirements
  • Military, MIL-STD-798, Nondestructive Testing for Piping System
  • Military, MIL-STD-883, Microelectronic device testing for military and aerospace systems
  • NEBS, GR-63-CORE, Earthquake and environmental hazards for networking equipment
  • SAE, SAE J3168, Reliability Physics Analysis of Electronic Equipment, Modules and Components