Ozen Engineering Newsletter – August 2016

Message from your Channel Partner 



ANSYS distributors from all around the world got together at the ANSYS headquarters during mid-July. This is the second year that ANSYS is hosting all these channel partners and it is great to see colleagues and exchange/share information about technology from different parts of the world. We are also presented with new ANSYS technology the details of which I cannot talk about here but I can definitely say, with ANSYS, great things are yet to come! First, R17.2 release which is expected any day now. Then, R18 which will be released at the end of the year. We can expect to see similar release schedules in the years to come. Having one major release a year followed by two minor ones is a sign that there is enormous R&D activity at ANSYS and that ANSYS is the market leader by a huge margin.

I am reminded to remind you that the new Multiphysics package, AIM, is now included with your ANSYS Mechanical Enterprise license as of R17.1 and that Simplorer will be included with R17.2. If you are not familiar with it, please read about Simplorer on our website on this page. With R18, we can also expect inclusion of “topological optimization” at no extra charge! But, with the current (R17.X) releases, there are already a bunch of exciting capabilities like “Non-linear Adaptivity”, “ANSYS proprietary fracture criterion”, additional geomechanics features, HPC enhancements, etc. on the mechanical side. On the CFD side, industry leading physics. On the high frequency electromagnetics side, market leading antenna design, EMI/EMC, signal integrity capabilities are all embedded in HFSS product. Needless to say, I am very excited about current and upcoming releases. ANSYS proved again that it is the industry leader not only in technology but in sales as well. Please let me know how I can be of help with your ANSYS software; I know that we have a solution for the type of engineering simulation need you may have. Have a great August!

By Metin Ozen

 Message from the VP of Sales

Introducing Evan Rago – Ozen Engineering’s New Sales Associate

thumbnail_Evan Rago

caseyWe are pleased to introduce our new sales associate – Evan Rago who just joined us in our Sunnyvale office.

Evan spent the last six month in ANSYS HQ in Canonsburg, PA to attend a rigorous sales and product training before transferring to Sunnyvale.

Evan is a graduate of the Swanson School of Engineering at the University of Pittsburgh where he holds a B.S. in Industrial Engineering and a Green Belt Certification in Six-Sigma.  Evan’s early experiences started out as an Application’s Engineer for a Carnegie Mellon University Start-Up company by the name of Seegrid.  He then moved to Paris, France, where he was a Project Manager for an AGV (automated guided vehicle) company named Balyo.  Shortly after his promotion to Project Manager North American, he decided to follow his passion for sales.  Now, Evan is part of the Ozen Engineering sales team. When he is not helping potential customers realize the cost savings of implementing a simulation driven product development, you can find him inside cooking, or outside hiking, skiing, or fishing.

Please join me in welcoming Evan to our sales team!

(408) 732-4665

By Casey Heydari

What’s New at Ozen Engineering?

Our Online Training Program

Are you dying to attend an Ozen Engineering training but just can’t get away from your desk?  Don’t worry!  Ozen Engineering now offers two new online options:

1) On Demand Training:

  • Receive links to recorded video lectures
  • Complete a knowledge test quiz after each section/at the end to show completion
  • 1 hour Gotomeeting session for questions and additional topics
  • Completely self-paced
2) Live Virtual Classroom:
  • Sessions – 2-hour Gotomeeting sessions on consecutive business days minus Friday (Number of sessions is to be determined based on the course)
  • Immediate feedback & workshop help
  • Flexible schedule
Are you interested in signing up? Contact us today at (408) 732-4665 or

 Tech Tip

Designing Next Big Things in IoT – ANSYS Chip Package System (CPS)


The rapid development of smart devices brings some engineering challenges, most particularly the increase in complexity of the products and their operating environment. Engineers must consider and include the comprehensive characteristic of the product and system in their design. The ANSYS Chip Package System (CPS) flow enables engineers to predict real-world performance of their products through simulation. ANSYS CPS addresses design challenges in Signal Integrity (SI), Power Integrity (PI), Electrostatic Discharge (ESD), Antenna Performance, Thermal and Structural challenges.


Smart Watch Design-Performing SI/PI, Thermal/Structural Integrity, and Antenna Performance

Power Efficacy

Low power design is an important fact in smart devices. It requires small voltage margins, fast transitions between power states, and low swing communication between components. SI/PI simulations consider all interactions between chip, package and board in a design. Analyzing the SI of a system requires co-simulation of IO ring, package, PCB decoupling and channel to ensure a system will meet its timing and performance target. PI analysis is required for optimizing the power delivery network (PDN) and implementation of low power design features with co-simulation of the chip, package, and PCB.


Signal and Power Integrity Analysis

Chip Modeling for system-level

ANSYS Integrated Circuit (IC) solution software like RedHawk and Totem validate low power design at the chip-level and also generate a Chip Power Model (CPM) for system-level PI and Electromagnetic Interference (EMI) analysis. ANSYS SIwave imports a CPM to drive a chip-package-board co-simulation. SIWave can be used to optimize component placement and decoupling capacitor solutions to achieve the best product performance and cost targets. Also in ANSYS 17.X, SIwave now have direct access to thermal simulation data and can map these effects to their electrical analysis.

Thermal/Structural Performance

Thermal/structural performance is another challenge in the product design consideration for packages and PCBs. Thermal impact on the package, especially from the IC, is a key driver for material selection, cooling, and form factor decisions, which ultimately determine the size, weight and cost of the final product. Therefore it is critical for design engineers to accurately model the thermal signature of their system and the thermal stress on the structural integrity of their product. ANSYS CPS flows use the same electrical layout database in thermal and mechanical analysis, so design engineers can easily map thermal to structural analysis to highlight deformation, strain and stress issues on the package.

Design Engineers must overcome these challenges and no other technology can help engineers, more than ANSYS Engineering Simulation. For more information, please visit our website – industry solution:

By Mehrnoosh Khabiri

Tech Tip

Transient Animation Improvements in CFD-Post 

CFD-Post Animation graphical user interface

CFD-Post Animation graphical user interface

Chris Cowan ImageANSYS CFD-Post is a state-of-the-art postprocessing tool used to visualize and quantify results from CFD simulations. At R17, transient flow variations are easier to animate using the new “Timestep Animation” option. This new capability uses ‘music-player’ style controls to play back transient results.
Some new user-interface options for Timestep Animation:
  • ‘Specify Range For Animation’ allows to trim the start/stop at specific timesteps instead of playing the entire animation.
  • ‘Advanced Frame Selection Controls’ allows to skip timesteps during the animation. This option is useful for speeding-up creation of animations from large results files.
By Chris Cowan
The deformed geometry capability in ANSYS R17 is one of the most powerful and easy to use new features in the latest release of ANSYS. In addition to the new workflows that it enables, you can also easily reverse engineer your deformed results using ANSYS SpaceClaim. In this post I’ll show how to take your deformed geometry to another ANSYS analysis. Then I’ll show how you can use the powerful reverse engineering features in SpaceClaim to make your deformed results into a geometry again.

Deformed Geometry – Analysis to Analysis

Where previously you needed to create named selections and use scripts with intermediate MAPDL and FEModeler systems, now you can just drag and drop connections on the Workbench schematic:


A couple of notes:

  • For dynamic analysis that use the Linear Perturbation method, this happens behind the scenes on the mesh already. No need to apply this for the standard harmonic analysis.
  • If you want to use this parametrically, you will need to apply loads on the downstream analysis with APDL or loads that are compatible with nodal named selections. All other named selections and loads will be lost/unassigned when the deformed geometry is updated.
  • The shape but not any stress states are transferred. If stress states are desired, the INISTATE APDL command will be necessary.

Deformed Geometry – Analysis to Geometry

You are not limited to just sending deformed geometry to another analysis, you can also send it back to a geometry using tools that you probably already have. Here we will work with a metal forming test case, done with ANSYS Autodyn. See this workflow in the video below.

The first step is to right click on the desired geometry result and select Export -> STL


The STL format is a faceted data format, which is not strictly compatible with the types of geometry that ANSYS and most CAD systems expect. You can think of it as a surface mesh of triangles around the geometry. It is not explicitly associated with a volume and if the quality of the STL file is poor, filling the mesh can be problematic. An STL surface mesh simply converted into a volume is a relatively inefficient way to represent geometry for ANSYS. Luckily we can do some reverse engineering in ANSYS SpaceClaim, a tool which you may already have.

Notice that our shell elements from ANSYS are represented as 3D in the exported deformed geometry. The STL file is brought in as a mesh body type. ANSYS SpaceClaim is used extensively in reverse engineering. We can see that we have a few options in the Insert -> Reverse Engineering section of the ribbon interface.


We will be using the Skin Surface tool. This allows us to define surface bounds and control points to create a surface corresponding to a surface mesh region. The initial attempt is fairly imprecise:


What happened here is that the surface mesh fitted to both the top AND bottom sides of the thin body. The primary way to deal with this is to sample smaller, less complex areas of the surface. The Skin surface tool lends itself naturally to this workflow of creating patches of several different surfaces.


See this video for more information on the reverse engineering features can capabilities of SpaceClaim.

Optionally we can also improve the quality of the mesh to better resolve the curvature using the Facets tab, enabled by an add-on license to SpaceClaim. It is used commonly in 3D printing applications and it has tools for working with dirtier meshes than what we will generally export from ANSYS.


Once we have all of the surfaces fitted and created, ideally it will turn into a solid automatically. There will typically be precision issues, though, that keep the surfaces from forming an airtight volume. The Repair -> Solidify section has tools to help with this. After fixing some small gaps we have a solid geometry.


Afterwards it is good practice to check the Deviation of how well the geometry matches the source mesh. We can do this in the Measure -> Deviation tool. Notice how the carefully created top surface patches have better deviation than the quick and dirty bottom surface patches.


Hopefully you’ve found that helpful!

By Kaan Divringi

Upcoming ANSYS Training & Events 

August & September

academic_logo_mediumProfessional Training:

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Ozen Engineering, Inc.
1210 E. Arques Ave #207
Sunnyvale, CA 94085
(408) 732-4665